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Group by: No Grouping | Item Type | Date | Language
Number of items: 27.

Hirmer, Katrin ; Hofmann, Klaus ; Casper, Thorben ; Schöps, Sebastian (2019)
3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by Measurements.
URSI Kleinheubacher Tagung (KHB 2019). Miltenberg, Germany (23.-25.09.2019)
Conference or Workshop Item, Bibliographie

Casper, Thorben ; Duque, David José ; Schöps, Sebastian ; De Gersem, Herbert (2019)
Automated Generation of Netlists from Electrothermal Field Models.
In: Nanoelectronic Coupled Problems Solutions
doi: 10.1007/978-3-030-30726-4_5
Book Section, Bibliographie

Duque, David José ; Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert ; Römer, Ulrich ; Gillon, Renaud ; Wieers, Aarnout ; Kratochvíl, Tomáš ; Götthans, Tomáš ; Meuris, Peter (2019)
Bond Wire Models.
In: Nanoelectronic Coupled Problems Solutions
doi: 10.1007/978-3-030-30726-4_3
Book Section, Bibliographie

Casper, Thorben ; Römer, Ulrich ; De Gersem, Herbert ; Schöps, Sebastian (2019)
Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging.
In: Computers & Mathematics with Applications
doi: 10.1016/j.camwa.2019.10.009
Article, Bibliographie

Casper, Thorben (2019)
Electrothermal Field and Circuit Simulation of Thin Wires and Evaluation of Failure Probabilities.
Technische Universität Darmstadt
Ph.D. Thesis, Primary publication

Casper, Thorben ; Duque, David ; Schöps, Sebastian ; De Gersem, Herbert (2019)
Automated Netlist Generation for 3D Electrothermal and Electromagnetic Field Problems.
In: Journal of Computational Electronics, 1809.08588
Article, Bibliographie

Krimm, Alexander ; Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert ; Chamoin, Ludovic (2019)
Proper Generalized Decomposition of Parameterized Electrothermal Problems Discretized by the Finite Integration Technique.
In: IEEE Transactions on Magnetics, 55 (6)
doi: 10.1109/TMAG.2019.2907223
Article, Bibliographie

Casper, Thorben ; Duque, David ; Schöps, Sebastian ; De Gersem, Herbert (2018)
Electric Circuits for Exact Representations of Spatially Discretised Electrothermal and Electromagnetic 3D Field Problems.
Workshop on Advances in Electromagnetic Research — KWT 2018. Rietzlern, Austria
Conference or Workshop Item, Bibliographie

Loukrezis, Dimitrios ; Römer, Ulrich ; Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert (2018)
High Dimensional Uncertainty Quantification for an Electrothermal Field Problem using Stochastic Collocation on Sparse Grids and Tensor Train Decomposition.
In: International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, 31 (2)
Article, Bibliographie

Loukrezis, Dimitrios ; Römer, Ulrich ; Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert (2018)
High-dimensional uncertainty quantification for an electrothermal field problem using stochastic collocation on sparse grids and tensor train decompositions.
In: International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, 2018
Article, Bibliographie

Bigalke, Steve ; Lienig, Jens ; Casper, Thorben ; Schöps, Sebastian
ed.: Gola, Alberto (2018)
Increasing EM Robustness of Placement and Routing Solutions based on Layout-Driven Discretization.
In: 14th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME 2018)
doi: 10.1109/PRIME.2018.8430323
Book Section, Bibliographie

Casper, Thorben (2017)
1D-3D Coupling to Include Thin Wires in Electrothermal Simulations Using FIT.
Workshop on Advances in Electromagnetic Research — KWT 2017.
Conference or Workshop Item, Bibliographie

Casper, Thorben ; Römer, Ulrich ; Schöps, Sebastian
ed.: Dyczij-Edlinger, Romanus (2017)
Determining Bond Wire Temperatures in Electronic Devices by a 1D-3D Coupling Approach.
URSI Kleinheubacher Tagung (KHB 2017). Miltenberg
Conference or Workshop Item, Bibliographie

Casper, Thorben ; Römer, Ulrich ; Schöps, Sebastian
ed.: Schäfer, Michael (2017)
On the Simulation of Thin Wires in a Coupled 1D-3D Setting.
4th International Conference on Computational Engineering (ICCE 2017). Darmstadt, Germany
Conference or Workshop Item, Bibliographie

Casper, Thorben ; Römer, Ulrich ; Schöps, Sebastian
ed.: Jung, Hyun-Kyo (2017)
An Electrothermal 1D-3D Coupling Approach for Thin Wires in Microelectronic Chip Packages.
21th Conference on the Computation of Electromagnetic Fields. Daejeon, Korea
Conference or Workshop Item, Bibliographie

Römer, Ulrich ; Casper, Thorben ; Schöps, Sebastian (2017)
Uncertainty Quantification for a Singular Electrothermal Coupled Problem with Error Control.
UNCECOMP 2017. Rhodes Island, Greece
Conference or Workshop Item, Bibliographie

Casper, Thorben ; Duque, David ; Schöps, Sebastian ; De Gersem, Herbert (2016)
Equivalent Netlist Extraction for Electrothermal and Electromagnetic Problems Discretized by the Finite Integration Technique.
11th Conference on Scientific Computing in Electrical Engineering (SCEE 2016).
Conference or Workshop Item, Bibliographie

Duque, David ; Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert
eds.: Wasenmüller, Uwe ; Sauer-Greff, Wolfgang (2016)
A Circuit-Based Approach for the Solution of Electrothermal and Electromagnetic Problems.
URSI Kleinheubacher Tagung (KHB 2016). Miltenberg
Conference or Workshop Item, Bibliographie

Casper, Thorben ; Römer, Ulrich ; Schöps, Sebastian (2016)
Determination of Bond Wire Failure Probabilities in Microelectronic Packages.
22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). Budapest (21-23 Sept. 2016)
doi: 10.1109/THERMINIC.2016.7748645
Conference or Workshop Item, Bibliographie

Loukrezis, Dimitrios ; Römer, Ulrich ; Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert (2016)
Application of High Dimensional Uncertainty Quantification Methods to Electrothermal Field Problems.
10th International Symposium on Electric and Magnetic Fields (EMF 2016).
Conference or Workshop Item, Bibliographie

Casper, Thorben ; De Gersem, Herbert ; Schöps, Sebastian (2016)
Automatic Generation of Equivalent Electrothermal SPICE Netlists from 3D Electrothermal Field Models.
EuroSimE 2016.
Conference or Workshop Item, Bibliographie

Casper, Thorben ; Römer, Ulrich ; Schöps, Sebastian (2016)
Efficient Evaluation of Bond Wire Fusing Probabilities.
SIAM Conference on Uncertainty Quantification 2016.
Conference or Workshop Item, Bibliographie

Casper, Thorben ; De Gersem, Herbert ; Gillon, Renaud ; Gotthans, Tomas ; Kratochvíl, Tomáš ; Meuris, Peter ; Schöps, Sebastian
eds.: Fanucci, Luca ; Teich, Jürgen (2016)
Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries.
In: Proceedings of the 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE)
Book Section, Bibliographie

Casper, Thorben ; De Gersem, Herbert ; Gotthans, Tomas ; Schoenmaker, Wim ; Schöps, Sebastian ; Wieers, Aarnout (2016)
Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries.
DATE 2016.
Conference or Workshop Item, Bibliographie

Casper, Thorben ; De Gersem, Herbert ; Schöps, Sebastian (2016)
Automatic Generation of Equivalent Electrothermal SPICE Netlists from 3D Electrothermal Field Models.
In: 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Book Section, Bibliographie

Maten, E. Jan W. ter ; Schöps, Sebastian ; Duque, David ; Casper, Thorben ; De Gersem, Herbert ; Römer, Ulrich (2016)
Nanoelectronic COupled problems solutions - nanoCOPS: modelling, multirate, model order reduction, uncertainty quantification, fast fault simulation.
In: Journal of Mathematics in Industry, 7 (2)
Article, Bibliographie

Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert (2015)
Electrothermal co-simulation of device structures in electronics.
YIC GACM 2015 — 3rd ECCOMAS Young Investigators Conference.
Conference or Workshop Item, Bibliographie

This list was generated on Sat Apr 13 01:35:03 2024 CEST.