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Number of items: 4.

Duque, David and Schöps, Sebastian and Wieers, Aarnout
Russo, Giovanni and Capasso, Vincenzo and Nicosia, Giuseppe (eds.) (2017):
Fast and Reliable Simulations of the Heating of Bond Wires.
In: Progress in Industrial Mathematics at ECMI 2014, Berlin, Springer, DOI: 10.1007/978-3-319-23413-7_114,
[Online-Edition: https://doi.org/10.1007/978-3-319-23413-7_114],
[Book Section]

Casper, Thorben and De Gersem, Herbert and Gotthans, Tomas and Schoenmaker, Wim and Schöps, Sebastian and Wieers, Aarnout (2016):
Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries.
In: DATE 2016, [Conference or Workshop Item]

Günther, Michael and Putek, Piotr and ter Maten, E. Jan W. and Pulch, Roland and Schoenmaker, Wim and Meuris, Peter and Wieers, Aarnout and Deleu, Frederik (2015):
Uncertainty Quantification in Electro-Thermal Coupled Problems based on a Power Transistor Device.
In: MATHMOD 2015 - 8th Vienna International Conference on Mathematical Modelling, [Conference or Workshop Item]

Duque, David and Schöps, Sebastian and De Gersem, Herbert and Wieers, Aarnout (2014):
nanoCOPS: Analytical Approach for Estimating the Heating of Bond-wires.
In: ECMI Newsletter 56, pp. 1-2, [Article]

This list was generated on Tue Jun 25 02:00:42 2019 CEST.