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Number of items: 5.

Duque, David José ; Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert ; Römer, Ulrich ; Gillon, Renaud ; Wieers, Aarnout ; Kratochvíl, Tomáš ; Götthans, Tomáš ; Meuris, Peter (2019):
Bond Wire Models.
In: Mathematics in Industry, 29, In: Nanoelectronic Coupled Problems Solutions, pp. 43-68, Cham, Springer, ISBN 978-3-030-30725-7,
DOI: 10.1007/978-3-030-30726-4_3,
[Book Section]

Duque, David ; Schöps, Sebastian ; Wieers, Aarnout
Russo, Giovanni ; Capasso, Vincenzo ; Nicosia, Giuseppe (eds.) (2017):
Fast and Reliable Simulations of the Heating of Bond Wires.
In: Mathematics in Industry, 22, In: Progress in Industrial Mathematics at ECMI 2014, Berlin, Springer, ISBN 978-3-319-23412-0,
DOI: 10.1007/978-3-319-23413-7_114,
[Book Section]

Casper, Thorben ; De Gersem, Herbert ; Gotthans, Tomas ; Schoenmaker, Wim ; Schöps, Sebastian ; Wieers, Aarnout (2016):
Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries.
DATE 2016, [Conference or Workshop Item]

Günther, Michael ; Putek, Piotr ; Maten, E. Jan W. ter ; Pulch, Roland ; Schoenmaker, Wim ; Meuris, Peter ; Wieers, Aarnout ; Deleu, Frederik (2015):
Uncertainty Quantification in Electro-Thermal Coupled Problems based on a Power Transistor Device.
MATHMOD 2015 - 8th Vienna International Conference on Mathematical Modelling, [Conference or Workshop Item]

Duque, David ; Schöps, Sebastian ; De Gersem, Herbert ; Wieers, Aarnout (2014):
nanoCOPS: Analytical Approach for Estimating the Heating of Bond-wires.
In: ECMI Newsletter 56, 56, pp. 70-71. [Article]

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