TU | ULB | News | Service | Recherche | Subjects | Collections | A-Z | Contact |

TU Darmstadt / ULB / TUbiblio

Determination of Bond Wire Failure Probabilities in Microelectronic Packages

Casper, Thorben and Römer, Ulrich and Schöps, Sebastian (2016):
Determination of Bond Wire Failure Probabilities in Microelectronic Packages.
In: 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), pp. 39-44, [Online-Edition: https://doi.org/10.1109/THERMINIC.2016.7748645],
[Book Section]

Item Type: Book Section
Erschienen: 2016
Creators: Casper, Thorben and Römer, Ulrich and Schöps, Sebastian
Title: Determination of Bond Wire Failure Probabilities in Microelectronic Packages
Language: English
Title of Book: 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Divisions: 18 Department of Electrical Engineering and Information Technology
18 Department of Electrical Engineering and Information Technology > Institute of Electromagnetic Field Theory (from 01.01.2019 renamed Institute for Accelerator Science and Electromagnetic Fields)
18 Department of Electrical Engineering and Information Technology > Institute of Electromagnetic Field Theory (from 01.01.2019 renamed Institute for Accelerator Science and Electromagnetic Fields) > Computational Engineering (from 01.01.2019 renamed Computational Electromagnetics)
Exzellenzinitiative
Exzellenzinitiative > Graduate Schools
Exzellenzinitiative > Graduate Schools > Graduate School of Computational Engineering (CE)
Event Title: 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Date Deposited: 04 Apr 2017 15:22
Official URL: https://doi.org/10.1109/THERMINIC.2016.7748645
Additional Information:

TEMF-Pub-DB TEMF002596
Related URLs:
Export:

Optionen (nur für Redakteure)

View Item View Item
OAI 2.0-Basis-URL: https://tubiblio.ulb.tu-darmstadt.de/cgi/oai2 TUbiblio verwendet EPrints 3.
Drucken | Impressum | Datenschutzerklärung