Casper, Thorben and Römer, Ulrich and Schöps, Sebastian (2016):
Determination of Bond Wire Failure Probabilities in Microelectronic Packages.
pp. 39-44, Budapest, 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Budapest, 21-23 Sept. 2016, DOI: 10.1109/THERMINIC.2016.7748645,
[Conference or Workshop Item]
Official URL: https://doi.org/10.1109/THERMINIC.2016.7748645
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