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Determination of Bond Wire Failure Probabilities in Microelectronic Packages

Casper, Thorben and Römer, Ulrich and Schöps, Sebastian :
Determination of Bond Wire Failure Probabilities in Microelectronic Packages.
[Online-Edition: https://doi.org/10.1109/THERMINIC.2016.7748645]
In: 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). , pp. 39-44.
[Book Section] , (2016)

Official URL: https://doi.org/10.1109/THERMINIC.2016.7748645
Item Type: Book Section
Erschienen: 2016
Creators: Casper, Thorben and Römer, Ulrich and Schöps, Sebastian
Title: Determination of Bond Wire Failure Probabilities in Microelectronic Packages
Language: English
Title of Book: 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Divisions: 18 Department of Electrical Engineering and Information Technology
18 Department of Electrical Engineering and Information Technology > Institute of Electromagnetic Field Theory
18 Department of Electrical Engineering and Information Technology > Institute of Electromagnetic Field Theory > Computational Engineering (2019 umbenannt in Computational Electromagnetics)
Exzellenzinitiative
Exzellenzinitiative > Graduate Schools
Exzellenzinitiative > Graduate Schools > Graduate School of Computational Engineering (CE)
Event Title: 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Date Deposited: 04 Apr 2017 15:22
Official URL: https://doi.org/10.1109/THERMINIC.2016.7748645
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TEMF-Pub-DB TEMF002596

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