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Determination of Bond Wire Failure Probabilities in Microelectronic Packages

Casper, Thorben and Römer, Ulrich and Schöps, Sebastian (2016):
Determination of Bond Wire Failure Probabilities in Microelectronic Packages.
pp. 39-44, Budapest, 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Budapest, 21-23 Sept. 2016, DOI: 10.1109/THERMINIC.2016.7748645,
[Conference or Workshop Item]

Item Type: Conference or Workshop Item
Erschienen: 2016
Creators: Casper, Thorben and Römer, Ulrich and Schöps, Sebastian
Title: Determination of Bond Wire Failure Probabilities in Microelectronic Packages
Language: English
Place of Publication: Budapest
Divisions: 18 Department of Electrical Engineering and Information Technology
18 Department of Electrical Engineering and Information Technology > Institute of Electromagnetic Field Theory (from 01.01.2019 renamed Institute for Accelerator Science and Electromagnetic Fields)
18 Department of Electrical Engineering and Information Technology > Institute of Electromagnetic Field Theory (from 01.01.2019 renamed Institute for Accelerator Science and Electromagnetic Fields) > Computational Engineering (from 01.01.2019 renamed Computational Electromagnetics)
Exzellenzinitiative
Exzellenzinitiative > Graduate Schools
Exzellenzinitiative > Graduate Schools > Graduate School of Computational Engineering (CE)
Event Title: 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Event Location: Budapest
Event Dates: 21-23 Sept. 2016
Date Deposited: 04 Apr 2017 15:22
DOI: 10.1109/THERMINIC.2016.7748645
Official URL: https://doi.org/10.1109/THERMINIC.2016.7748645
Additional Information:

TEMF-Pub-DB TEMF002596
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