Determination of Bond Wire Failure Probabilities in Microelectronic Packages

Item Type:	Book Section
Erschienen:	2016
Creators:	Casper, Thorben and Römer, Ulrich and Schöps, Sebastian
Title:	Determination of Bond Wire Failure Probabilities in Microelectronic Packages
Language:	English
Title of Book:	22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Divisions:	18 Department of Electrical Engineering and Information Technology 18 Department of Electrical Engineering and Information Technology > Institute of Electromagnetic Field Theory 18 Department of Electrical Engineering and Information Technology > Institute of Electromagnetic Field Theory > Computational Engineering (2019 umbenannt in Computational Electromagnetics) Exzellenzinitiative Exzellenzinitiative > Graduate Schools Exzellenzinitiative > Graduate Schools > Graduate School of Computational Engineering (CE)
Event Title:	22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Date Deposited:	04 Apr 2017 15:22
Official URL:	https://doi.org/10.1109/THERMINIC.2016.7748645
Additional Information:	TEMF-Pub-DB TEMF002596
Related URLs:	https://arxiv.org/abs/1609.06187
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