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Determination of Bond Wire Failure Probabilities in Microelectronic Packages

Casper, Thorben and Römer, Ulrich and Schöps, Sebastian (2016):
Determination of Bond Wire Failure Probabilities in Microelectronic Packages.
Budapest, In: 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Budapest, 21-23 Sept. 2016, DOI: 10.1109/THERMINIC.2016.7748645,
[Online-Edition: https://doi.org/10.1109/THERMINIC.2016.7748645],
[Conference or Workshop Item]

Official URL: https://doi.org/10.1109/THERMINIC.2016.7748645

Item Type:	Conference or Workshop Item
Erschienen:	2016
Creators:	Casper, Thorben and Römer, Ulrich and Schöps, Sebastian
Title:	Determination of Bond Wire Failure Probabilities in Microelectronic Packages
Language:	English
Place of Publication:	Budapest
Divisions:	18 Department of Electrical Engineering and Information Technology 18 Department of Electrical Engineering and Information Technology > Institute of Electromagnetic Field Theory (from 01.01.2019 renamed Institute for Accelerator Science and Electromagnetic Fields) 18 Department of Electrical Engineering and Information Technology > Institute of Electromagnetic Field Theory (from 01.01.2019 renamed Institute for Accelerator Science and Electromagnetic Fields) > Computational Engineering (from 01.01.2019 renamed Computational Electromagnetics) Exzellenzinitiative Exzellenzinitiative > Graduate Schools Exzellenzinitiative > Graduate Schools > Graduate School of Computational Engineering (CE)
Event Title:	22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Event Location:	Budapest
Event Dates:	21-23 Sept. 2016
Date Deposited:	04 Apr 2017 15:22
DOI:	10.1109/THERMINIC.2016.7748645
Official URL:	https://doi.org/10.1109/THERMINIC.2016.7748645
Additional Information:	TEMF-Pub-DB TEMF002596
Related URLs:	https://arxiv.org/abs/1609.06187
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