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Number of items: 3.

Duque, David José ; Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert ; Römer, Ulrich ; Gillon, Renaud ; Wieers, Aarnout ; Kratochvíl, Tomáš ; Götthans, Tomáš ; Meuris, Peter (2019):
Bond Wire Models.
In: Mathematics in Industry, 29, In: Nanoelectronic Coupled Problems Solutions, pp. 43-68, Cham, Springer, ISBN 978-3-030-30725-7,
DOI: 10.1007/978-3-030-30726-4_3,
[Book Section]

Casper, Thorben ; De Gersem, Herbert ; Gillon, Renaud ; Gotthans, Tomas ; Kratochvíl, Tomáš ; Meuris, Peter ; Schöps, Sebastian
Fanucci, Luca ; Teich, Jürgen (eds.) (2016):
Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries.
In: Proceedings of the 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE), pp. 1297-1302, IEEE, ISBN 978-3-9815370-6-2,
[Book Section]

Günther, Michael ; Putek, Piotr ; Maten, E. Jan W. ter ; Pulch, Roland ; Schoenmaker, Wim ; Meuris, Peter ; Wieers, Aarnout ; Deleu, Frederik (2015):
Uncertainty Quantification in Electro-Thermal Coupled Problems based on a Power Transistor Device.
MATHMOD 2015 - 8th Vienna International Conference on Mathematical Modelling, [Conference or Workshop Item]

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