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Determining Bond Wire Temperatures in Electronic Devices by a 1D-3D Coupling Approach

Casper, Thorben and Römer, Ulrich and Schöps, Sebastian Dyczij-Edlinger, Romanus (ed.) (2017):
Determining Bond Wire Temperatures in Electronic Devices by a 1D-3D Coupling Approach.
Miltenberg, URSI Kleinheubacher Tagung (KHB 2017), Miltenberg, [Conference or Workshop Item]

Official URL: https://www.kh2017.de
Item Type: Conference or Workshop Item
Erschienen: 2017
Editors: Dyczij-Edlinger, Romanus
Creators: Casper, Thorben and Römer, Ulrich and Schöps, Sebastian
Title: Determining Bond Wire Temperatures in Electronic Devices by a 1D-3D Coupling Approach
Language: English
Place of Publication: Miltenberg
Divisions: 18 Department of Electrical Engineering and Information Technology
18 Department of Electrical Engineering and Information Technology > Institute of Electromagnetic Field Theory (from 01.01.2019 renamed Institute for Accelerator Science and Electromagnetic Fields) > Computational Engineering (from 01.01.2019 renamed Computational Electromagnetics)
Exzellenzinitiative > Graduate Schools > Graduate School of Computational Engineering (CE)
18 Department of Electrical Engineering and Information Technology > Institute of Electromagnetic Field Theory (from 01.01.2019 renamed Institute for Accelerator Science and Electromagnetic Fields)
Exzellenzinitiative > Graduate Schools
Exzellenzinitiative
Event Title: URSI Kleinheubacher Tagung (KHB 2017)
Event Location: Miltenberg
Date Deposited: 23 Sep 2017 16:15
Official URL: https://www.kh2017.de
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