Duque, David José and Casper, Thorben and Schöps, Sebastian and De Gersem, Herbert and Römer, Ulrich and Gillon, Renaud and Wieers, Aarnout and Kratochvíl, Tomáš and Götthans, Tomáš and Meuris, Peter (2019):
Bond Wire Models.
In: Mathematics in Industry, In: Nanoelectronic Coupled Problems Solutions, Cham, Springer, pp. 43-68, DOI: 10.1007/978-3-030-30726-4_3,
[Online-Edition: https://link.springer.com/chapter/10.1007/978-3-030-30726-4_...],
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Casper, Thorben and De Gersem, Herbert and Gillon, Renaud and Gotthans, Tomas and Kratochvíl, Tomáš and Meuris, Peter and Schöps, Sebastian Fanucci, Luca and Teich, Jürgen (eds.) (2016):
Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries.
In: Proceedings of the 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE), IEEE, pp. 1297-1302, [Online-Edition: http://ieeexplore.ieee.org/document/7459510],
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