Number of items: 1.
Casper, Thorben and De Gersem, Herbert and Gillon, Renaud and Gotthans, Tomas and Kratochvíl, Tomáš and Meuris, Peter and Schöps, Sebastian
Fanucci, Luca and Teich, Jürgen (eds.)
:
Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries.
[Online-Edition: http://ieeexplore.ieee.org/document/7459510]
In:
Proceedings of the 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE).
IEEE
, pp. 1297-1302.
ISBN 978-3-9815370-6-2
[Book Section]
, (2016)
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