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An Electrothermal 1D-3D Coupling Approach for Thin Wires in Microelectronic Chip Packages

Casper, Thorben and Römer, Ulrich and Schöps, Sebastian Jung, Hyun-Kyo (ed.) (2017):
An Electrothermal 1D-3D Coupling Approach for Thin Wires in Microelectronic Chip Packages.
Daejeon, Korea, 21th Conference on the Computation of Electromagnetic Fields, Daejeon, Korea, [Conference or Workshop Item]

Item Type: Conference or Workshop Item
Erschienen: 2017
Editors: Jung, Hyun-Kyo
Creators: Casper, Thorben and Römer, Ulrich and Schöps, Sebastian
Title: An Electrothermal 1D-3D Coupling Approach for Thin Wires in Microelectronic Chip Packages
Language: English
Place of Publication: Daejeon, Korea
Divisions: 18 Department of Electrical Engineering and Information Technology
18 Department of Electrical Engineering and Information Technology > Institute of Electromagnetic Field Theory (from 01.01.2019 renamed Institute for Accelerator Science and Electromagnetic Fields) > Computational Engineering (from 01.01.2019 renamed Computational Electromagnetics)
Exzellenzinitiative > Graduate Schools > Graduate School of Computational Engineering (CE)
18 Department of Electrical Engineering and Information Technology > Institute of Electromagnetic Field Theory (from 01.01.2019 renamed Institute for Accelerator Science and Electromagnetic Fields)
Exzellenzinitiative > Graduate Schools
Exzellenzinitiative
Event Title: 21th Conference on the Computation of Electromagnetic Fields
Event Location: Daejeon, Korea
Date Deposited: 23 Sep 2017 16:14
Official URL: http://www.compumag2017.com
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