An Electrothermal 1D-3D Coupling Approach for Thin Wires in Microelectronic Chip Packages

Item Type:	Conference or Workshop Item
Erschienen:	2017
Editors:	Jung, Hyun-Kyo
Creators:	Casper, Thorben and Römer, Ulrich and Schöps, Sebastian
Title:	An Electrothermal 1D-3D Coupling Approach for Thin Wires in Microelectronic Chip Packages
Language:	English
Place of Publication:	Daejeon, Korea
Divisions:	18 Department of Electrical Engineering and Information Technology 18 Department of Electrical Engineering and Information Technology > Institute of Electromagnetic Field Theory > Computational Engineering (2019 umbenannt in Computational Electromagnetics) Exzellenzinitiative > Graduate Schools > Graduate School of Computational Engineering (CE) 18 Department of Electrical Engineering and Information Technology > Institute of Electromagnetic Field Theory Exzellenzinitiative > Graduate Schools Exzellenzinitiative
Event Title:	21th Conference on the Computation of Electromagnetic Fields
Event Location:	Daejeon, Korea
Date Deposited:	23 Sep 2017 16:14
Official URL:	http://www.compumag2017.com
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