Casper, Thorben and Römer, Ulrich and Schöps, Sebastian Jung, Hyun-Kyo (ed.) (2017):
An Electrothermal 1D-3D Coupling Approach for Thin Wires in Microelectronic Chip Packages.
Daejeon, Korea, 21th Conference on the Computation of Electromagnetic Fields, Daejeon, Korea, [Conference or Workshop Item]
Official URL: http://www.compumag2017.com
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