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Casper, Thorben ; Duque, David ; Schöps, Sebastian ; De Gersem, Herbert :
Electric Circuits for Exact Representations of Spatially Discretised Electrothermal and Electromagnetic 3D Field Problems.
[Online-Edition: http://maxwell-in-motion.org]
In: Workshop on Advances in Electromagnetic Research — KWT 2018, Rietzlern, Austria. Maxwell in Motion , Rietzlern, Austria
[Konferenz- oder Workshop-Beitrag] , (2018)

Loukrezis, Dimitrios ; Römer, Ulrich ; Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert :
High Dimensional Uncertainty Quantification for an Electrothermal Field Problem using Stochastic Collocation on Sparse Grids and Tensor Train Decomposition.
[Online-Edition: https://doi.org/10.1002/jnm.2222]
In: International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, 31 (2) ISSN 1099-1204
[Artikel] , (2018)

Bigalke, Steve ; Lienig, Jens ; Casper, Thorben ; Schöps, Sebastian
Gola, Alberto (ed.) :

Increasing EM Robustness of Placement and Routing Solutions based on Layout-Driven Discretization.
[Online-Edition: https://doi.org/10.1109/PRIME.2018.8430323]
In: 14th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME 2018). IEEE
[Buchkapitel] , (2018)

Casper, Thorben :
1D-3D Coupling to Include Thin Wires in Electrothermal Simulations Using FIT.
[Online-Edition: http://maxwell-in-motion.org]
In: Workshop on Advances in Electromagnetic Research — KWT 2017.
[Konferenz- oder Workshop-Beitrag] , (2017)

Casper, Thorben ; Römer, Ulrich ; Schöps, Sebastian
Dyczij-Edlinger, Romanus (ed.) :

Determining Bond Wire Temperatures in Electronic Devices by a 1D-3D Coupling Approach.
[Online-Edition: https://www.kh2017.de]
In: URSI Kleinheubacher Tagung (KHB 2017), Miltenberg. Miltenberg
[Konferenz- oder Workshop-Beitrag] , (2017)

Casper, Thorben ; Römer, Ulrich ; Schöps, Sebastian
Schäfer, Michael (ed.) :

On the Simulation of Thin Wires in a Coupled 1D-3D Setting.
In: 4th International Conference on Computational Engineering (ICCE 2017), Darmstadt, Germany. Darmstadt, Germany
[Konferenz- oder Workshop-Beitrag] , (2017)

Casper, Thorben ; Römer, Ulrich ; Schöps, Sebastian
Jung, Hyun-Kyo (ed.) :

An Electrothermal 1D-3D Coupling Approach for Thin Wires in Microelectronic Chip Packages.
[Online-Edition: http://www.compumag2017.com]
In: 21th Conference on the Computation of Electromagnetic Fields, Daejeon, Korea. Daejeon, Korea
[Konferenz- oder Workshop-Beitrag] , (2017)

Römer, Ulrich ; Casper, Thorben ; Schöps, Sebastian :
Uncertainty Quantification for a Singular Electrothermal Coupled Problem with Error Control.
[Online-Edition: https://2017.uncecomp.org]
In: UNCECOMP 2017, Rhodes Island, Greece. Rhodes Island, Greece
[Konferenz- oder Workshop-Beitrag] , (2017)

Casper, Thorben ; Duque, David ; Schöps, Sebastian ; De Gersem, Herbert :
Equivalent Netlist Extraction for Electrothermal and Electromagnetic Problems Discretized by the Finite Integration Technique.
[Online-Edition: http://www.ricam.oeaw.ac.at/events/conferences/scee2016]
In: 11th Conference on Scientific Computing in Electrical Engineering (SCEE 2016).
[Konferenz- oder Workshop-Beitrag] , (2016)

Duque, David ; Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert
Wasenmüller, Uwe ; Sauer-Greff, Wolfgang (eds.) :

A Circuit-Based Approach for the Solution of Electrothermal and Electromagnetic Problems.
[Online-Edition: https://www.kh2016.de]
In: URSI Kleinheubacher Tagung (KHB 2016), Miltenberg. Miltenberg
[Konferenz- oder Workshop-Beitrag] , (2016)

Casper, Thorben ; Römer, Ulrich ; Schöps, Sebastian :
Determination of Bond Wire Failure Probabilities in Microelectronic Packages.
[Online-Edition: http://www.therminic2016.eu]
In: THERMINIC 2016.
[Konferenz- oder Workshop-Beitrag] , (2016)

Loukrezis, Dimitrios ; Römer, Ulrich ; Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert :
Application of High Dimensional Uncertainty Quantification Methods to Electrothermal Field Problems.
[Online-Edition: http://www.aimontefiore.org/emf2016/]
In: 10th International Symposium on Electric and Magnetic Fields (EMF 2016).
[Konferenz- oder Workshop-Beitrag] , (2016)

Casper, Thorben ; De Gersem, Herbert ; Schöps, Sebastian :
Automatic Generation of Equivalent Electrothermal SPICE Netlists from 3D Electrothermal Field Models.
In: EuroSimE 2016.
[Konferenz- oder Workshop-Beitrag] , (2016)

Casper, Thorben ; Römer, Ulrich ; Schöps, Sebastian :
Efficient Evaluation of Bond Wire Fusing Probabilities.
[Online-Edition: https://www.siam.org/meetings/uq16/]
In: SIAM Conference on Uncertainty Quantification 2016.
[Konferenz- oder Workshop-Beitrag] , (2016)

Casper, Thorben ; De Gersem, Herbert ; Gillon, Renaud ; Gotthans, Tomas ; Kratochvíl, Tomáš ; Meuris, Peter ; Schöps, Sebastian
Fanucci, Luca ; Teich, Jürgen (eds.) :

Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries.
[Online-Edition: http://ieeexplore.ieee.org/document/7459510]
In: Proceedings of the 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE). IEEE , pp. 1297-1302. ISBN 978-3-9815370-6-2
[Buchkapitel] , (2016)

Casper, Thorben ; De Gersem, Herbert ; Gotthans, Tomas ; Schoenmaker, Wim ; Schöps, Sebastian ; Wieers, Aarnout :
Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries.
In: DATE 2016.
[Konferenz- oder Workshop-Beitrag] , (2016)

Casper, Thorben ; De Gersem, Herbert ; Schöps, Sebastian :
Automatic Generation of Equivalent Electrothermal SPICE Netlists from 3D Electrothermal Field Models.
[Online-Edition: https://doi.org/10.1109/EuroSimE.2016.7463329]
In: 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). , pp. 1-8.
[Buchkapitel] , (2016)

Casper, Thorben ; Römer, Ulrich ; Schöps, Sebastian :
Determination of Bond Wire Failure Probabilities in Microelectronic Packages.
[Online-Edition: https://doi.org/10.1109/THERMINIC.2016.7748645]
In: 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). , pp. 39-44.
[Buchkapitel] , (2016)

ter Maten, E. Jan W. ; Schöps, Sebastian ; Duque, David ; Casper, Thorben ; De Gersem, Herbert ; Römer, Ulrich :
Nanoelectronic COupled problems solutions - nanoCOPS: modelling, multirate, model order reduction, uncertainty quantification, fast fault simulation.
[Online-Edition: https://dx.doi.org/10.1186/s13362-016-0025-5]
In: Journal of Mathematics in Industry, 7 (2) ISSN 2190-5983
[Artikel] , (2016)

Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert :
Electrothermal co-simulation of device structures in electronics.
In: YIC GACM 2015 — 3rd ECCOMAS Young Investigators Conference.
[Konferenz- oder Workshop-Beitrag] , (2015)

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