TU Darmstadt / ULB / TUbiblio

Browse by Person

Up a level
Export as [feed] Atom [feed] RSS 1.0 [feed] RSS 2.0
Group by: No Grouping | Item Type | Date | Language
Number of items: 23.

Hirmer, Katrin and Casper, Thorben and Schöps, Sebastian and Hofmann, Klaus
Bogenfeld, Eckard (ed.) (2019):
3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by Measurements.
In: URSI Kleinheubacher Tagung (KHB 2019), Miltenberg, 23.–25.09.2019, [Online-Edition: https://www.kh2019.de],
[Conference or Workshop Item]

Casper, Thorben and Duque, David and Schöps, Sebastian and De Gersem, Herbert (2019):
Automated Netlist Generation for 3D Electrothermal and Electromagnetic Field Problems.
In: Journal of Computational Electronics, 1809.08588, [Article]

Krimm, Alexander and Casper, Thorben and Schöps, Sebastian and De Gersem, Herbert and Chamoin, Ludovic (2019):
Proper Generalized Decomposition of Parameterized Electrothermal Problems Discretized by the Finite Integration Technique.
In: IEEE Transactions on Magnetics, IEEE, 55, (6), ISSN 0018-9464,
DOI: 10.1109/TMAG.2019.2907223,
[Online-Edition: https://doi.org/10.1109/TMAG.2019.2907223],
[Article]

Casper, Thorben and Duque, David and Schöps, Sebastian and De Gersem, Herbert (2018):
Electric Circuits for Exact Representations of Spatially Discretised Electrothermal and Electromagnetic 3D Field Problems.
Maxwell in Motion, In: Workshop on Advances in Electromagnetic Research — KWT 2018, Rietzlern, Austria, [Online-Edition: http://maxwell-in-motion.org],
[Conference or Workshop Item]

Loukrezis, Dimitrios and Römer, Ulrich and Casper, Thorben and Schöps, Sebastian and De Gersem, Herbert (2018):
High Dimensional Uncertainty Quantification for an Electrothermal Field Problem using Stochastic Collocation on Sparse Grids and Tensor Train Decomposition.
In: International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, 31, (2), ISSN 1099-1204,
[Online-Edition: https://doi.org/10.1002/jnm.2222],
[Article]

Casper, Thorben and Römer, Ulrich and De Gersem, Herbert and Schöps, Sebastian (2018):
Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging.
In: arXiv, [Report]

Bigalke, Steve and Lienig, Jens and Casper, Thorben and Schöps, Sebastian
Gola, Alberto (ed.) (2018):
Increasing EM Robustness of Placement and Routing Solutions based on Layout-Driven Discretization.
In: 14th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME 2018), IEEE, DOI: 10.1109/PRIME.2018.8430323,
[Online-Edition: https://doi.org/10.1109/PRIME.2018.8430323],
[Book Section]

Casper, Thorben (2017):
1D-3D Coupling to Include Thin Wires in Electrothermal Simulations Using FIT.
In: Workshop on Advances in Electromagnetic Research — KWT 2017, [Online-Edition: http://maxwell-in-motion.org],
[Conference or Workshop Item]

Casper, Thorben and Römer, Ulrich and Schöps, Sebastian
Dyczij-Edlinger, Romanus (ed.) (2017):
Determining Bond Wire Temperatures in Electronic Devices by a 1D-3D Coupling Approach.
Miltenberg, In: URSI Kleinheubacher Tagung (KHB 2017), Miltenberg, [Online-Edition: https://www.kh2017.de],
[Conference or Workshop Item]

Casper, Thorben and Römer, Ulrich and Schöps, Sebastian
Schäfer, Michael (ed.) (2017):
On the Simulation of Thin Wires in a Coupled 1D-3D Setting.
Darmstadt, Germany, In: 4th International Conference on Computational Engineering (ICCE 2017), Darmstadt, Germany, [Conference or Workshop Item]

Casper, Thorben and Römer, Ulrich and Schöps, Sebastian
Jung, Hyun-Kyo (ed.) (2017):
An Electrothermal 1D-3D Coupling Approach for Thin Wires in Microelectronic Chip Packages.
Daejeon, Korea, In: 21th Conference on the Computation of Electromagnetic Fields, Daejeon, Korea, [Online-Edition: http://www.compumag2017.com],
[Conference or Workshop Item]

Römer, Ulrich and Casper, Thorben and Schöps, Sebastian (2017):
Uncertainty Quantification for a Singular Electrothermal Coupled Problem with Error Control.
Rhodes Island, Greece, In: UNCECOMP 2017, Rhodes Island, Greece, [Online-Edition: https://2017.uncecomp.org],
[Conference or Workshop Item]

Casper, Thorben and Duque, David and Schöps, Sebastian and De Gersem, Herbert (2016):
Equivalent Netlist Extraction for Electrothermal and Electromagnetic Problems Discretized by the Finite Integration Technique.
In: 11th Conference on Scientific Computing in Electrical Engineering (SCEE 2016), [Online-Edition: http://www.ricam.oeaw.ac.at/events/conferences/scee2016],
[Conference or Workshop Item]

Duque, David and Casper, Thorben and Schöps, Sebastian and De Gersem, Herbert
Wasenmüller, Uwe and Sauer-Greff, Wolfgang (eds.) (2016):
A Circuit-Based Approach for the Solution of Electrothermal and Electromagnetic Problems.
Miltenberg, In: URSI Kleinheubacher Tagung (KHB 2016), Miltenberg, [Online-Edition: https://www.kh2016.de],
[Conference or Workshop Item]

Casper, Thorben and Römer, Ulrich and Schöps, Sebastian (2016):
Determination of Bond Wire Failure Probabilities in Microelectronic Packages.
Budapest, In: 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Budapest, 21-23 Sept. 2016, DOI: 10.1109/THERMINIC.2016.7748645,
[Online-Edition: https://doi.org/10.1109/THERMINIC.2016.7748645],
[Conference or Workshop Item]

Loukrezis, Dimitrios and Römer, Ulrich and Casper, Thorben and Schöps, Sebastian and De Gersem, Herbert (2016):
Application of High Dimensional Uncertainty Quantification Methods to Electrothermal Field Problems.
In: 10th International Symposium on Electric and Magnetic Fields (EMF 2016), [Online-Edition: http://www.aimontefiore.org/emf2016/],
[Conference or Workshop Item]

Casper, Thorben and De Gersem, Herbert and Schöps, Sebastian (2016):
Automatic Generation of Equivalent Electrothermal SPICE Netlists from 3D Electrothermal Field Models.
In: EuroSimE 2016, [Conference or Workshop Item]

Casper, Thorben and Römer, Ulrich and Schöps, Sebastian (2016):
Efficient Evaluation of Bond Wire Fusing Probabilities.
In: SIAM Conference on Uncertainty Quantification 2016, [Online-Edition: https://www.siam.org/meetings/uq16/],
[Conference or Workshop Item]

Casper, Thorben and De Gersem, Herbert and Gillon, Renaud and Gotthans, Tomas and Kratochvíl, Tomáš and Meuris, Peter and Schöps, Sebastian
Fanucci, Luca and Teich, Jürgen (eds.) (2016):
Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries.
In: Proceedings of the 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE), IEEE, pp. 1297-1302, [Online-Edition: http://ieeexplore.ieee.org/document/7459510],
[Book Section]

Casper, Thorben and De Gersem, Herbert and Gotthans, Tomas and Schoenmaker, Wim and Schöps, Sebastian and Wieers, Aarnout (2016):
Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries.
In: DATE 2016, [Conference or Workshop Item]

Casper, Thorben and De Gersem, Herbert and Schöps, Sebastian (2016):
Automatic Generation of Equivalent Electrothermal SPICE Netlists from 3D Electrothermal Field Models.
In: 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), pp. 1-8, [Online-Edition: https://doi.org/10.1109/EuroSimE.2016.7463329],
[Book Section]

ter Maten, E. Jan W. and Schöps, Sebastian and Duque, David and Casper, Thorben and De Gersem, Herbert and Römer, Ulrich (2016):
Nanoelectronic COupled problems solutions - nanoCOPS: modelling, multirate, model order reduction, uncertainty quantification, fast fault simulation.
In: Journal of Mathematics in Industry, Springer, 7, (2), ISSN 2190-5983,
[Online-Edition: https://dx.doi.org/10.1186/s13362-016-0025-5],
[Article]

Casper, Thorben and Schöps, Sebastian and De Gersem, Herbert (2015):
Electrothermal co-simulation of device structures in electronics.
In: YIC GACM 2015 — 3rd ECCOMAS Young Investigators Conference, [Conference or Workshop Item]

This list was generated on Tue Oct 22 01:02:23 2019 CEST.