Hirmer, Katrin ; Hofmann, Klaus ; Casper, Thorben ; Schöps, Sebastian (2019)
3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by Measurements.
URSI Kleinheubacher Tagung (KHB 2019). Miltenberg, Germany (23.09.2019-25.09.2019)
Konferenzveröffentlichung, Bibliographie

Casper, Thorben ; Duque, David José ; Schöps, Sebastian ; De Gersem, Herbert (2019)
Automated Generation of Netlists from Electrothermal Field Models.
In: Nanoelectronic Coupled Problems Solutions
doi: 10.1007/978-3-030-30726-4_5
Buchkapitel, Bibliographie

Duque, David José ; Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert ; Römer, Ulrich ; Gillon, Renaud ; Wieers, Aarnout ; Kratochvíl, Tomáš ; Götthans, Tomáš ; Meuris, Peter (2019)
Bond Wire Models.
In: Nanoelectronic Coupled Problems Solutions
doi: 10.1007/978-3-030-30726-4_3
Buchkapitel, Bibliographie

Casper, Thorben ; Römer, Ulrich ; De Gersem, Herbert ; Schöps, Sebastian (2019)
Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging.
In: Computers & Mathematics with Applications
doi: 10.1016/j.camwa.2019.10.009
Artikel, Bibliographie

Casper, Thorben (2019)
Electrothermal Field and Circuit Simulation of Thin Wires and Evaluation of Failure Probabilities.
Technische Universität Darmstadt
Dissertation, Erstveröffentlichung

Casper, Thorben ; Duque, David ; Schöps, Sebastian ; De Gersem, Herbert (2019)
Automated Netlist Generation for 3D Electrothermal and Electromagnetic Field Problems.
In: Journal of Computational Electronics, 1809.08588
Artikel, Bibliographie

Krimm, Alexander ; Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert ; Chamoin, Ludovic (2019)
Proper Generalized Decomposition of Parameterized Electrothermal Problems Discretized by the Finite Integration Technique.
In: IEEE Transactions on Magnetics, 55 (6)
doi: 10.1109/TMAG.2019.2907223
Artikel, Bibliographie

Casper, Thorben ; Duque, David ; Schöps, Sebastian ; De Gersem, Herbert (2018)
Electric Circuits for Exact Representations of Spatially Discretised Electrothermal and Electromagnetic 3D Field Problems.
Workshop on Advances in Electromagnetic Research — KWT 2018. Rietzlern, Austria
Konferenzveröffentlichung, Bibliographie

Loukrezis, Dimitrios ; Römer, Ulrich ; Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert (2018)
High Dimensional Uncertainty Quantification for an Electrothermal Field Problem using Stochastic Collocation on Sparse Grids and Tensor Train Decomposition.
In: International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, 31 (2)
Artikel, Bibliographie

Loukrezis, Dimitrios ; Römer, Ulrich ; Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert (2018)
High-dimensional uncertainty quantification for an electrothermal field problem using stochastic collocation on sparse grids and tensor train decompositions.
In: International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, 2018
Artikel, Bibliographie

Bigalke, Steve ; Lienig, Jens ; Casper, Thorben ; Schöps, Sebastian
Hrsg.: Gola, Alberto (2018)
Increasing EM Robustness of Placement and Routing Solutions based on Layout-Driven Discretization.
In: 14th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME 2018)
doi: 10.1109/PRIME.2018.8430323
Buchkapitel, Bibliographie

Casper, Thorben (2017)
1D-3D Coupling to Include Thin Wires in Electrothermal Simulations Using FIT.
Workshop on Advances in Electromagnetic Research — KWT 2017.
Konferenzveröffentlichung, Bibliographie

Casper, Thorben ; Römer, Ulrich ; Schöps, Sebastian
Hrsg.: Dyczij-Edlinger, Romanus (2017)
Determining Bond Wire Temperatures in Electronic Devices by a 1D-3D Coupling Approach.
URSI Kleinheubacher Tagung (KHB 2017). Miltenberg
Konferenzveröffentlichung, Bibliographie

Casper, Thorben ; Römer, Ulrich ; Schöps, Sebastian
Hrsg.: Schäfer, Michael (2017)
On the Simulation of Thin Wires in a Coupled 1D-3D Setting.
4th International Conference on Computational Engineering (ICCE 2017). Darmstadt, Germany
Konferenzveröffentlichung, Bibliographie

Casper, Thorben ; Römer, Ulrich ; Schöps, Sebastian
Hrsg.: Jung, Hyun-Kyo (2017)
An Electrothermal 1D-3D Coupling Approach for Thin Wires in Microelectronic Chip Packages.
21th Conference on the Computation of Electromagnetic Fields. Daejeon, Korea
Konferenzveröffentlichung, Bibliographie

Römer, Ulrich ; Casper, Thorben ; Schöps, Sebastian (2017)
Uncertainty Quantification for a Singular Electrothermal Coupled Problem with Error Control.
UNCECOMP 2017. Rhodes Island, Greece
Konferenzveröffentlichung, Bibliographie

Casper, Thorben ; Duque, David ; Schöps, Sebastian ; De Gersem, Herbert (2016)
Equivalent Netlist Extraction for Electrothermal and Electromagnetic Problems Discretized by the Finite Integration Technique.
11th Conference on Scientific Computing in Electrical Engineering (SCEE 2016).
Konferenzveröffentlichung, Bibliographie

Duque, David ; Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert
Hrsg.: Wasenmüller, Uwe ; Sauer-Greff, Wolfgang (2016)
A Circuit-Based Approach for the Solution of Electrothermal and Electromagnetic Problems.
URSI Kleinheubacher Tagung (KHB 2016). Miltenberg
Konferenzveröffentlichung, Bibliographie

Casper, Thorben ; Römer, Ulrich ; Schöps, Sebastian (2016)
Determination of Bond Wire Failure Probabilities in Microelectronic Packages.
22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). Budapest (21.09.2016-23.09.2016)
doi: 10.1109/THERMINIC.2016.7748645
Konferenzveröffentlichung, Bibliographie

Loukrezis, Dimitrios ; Römer, Ulrich ; Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert (2016)
Application of High Dimensional Uncertainty Quantification Methods to Electrothermal Field Problems.
10th International Symposium on Electric and Magnetic Fields (EMF 2016).
Konferenzveröffentlichung, Bibliographie

Casper, Thorben ; De Gersem, Herbert ; Schöps, Sebastian (2016)
Automatic Generation of Equivalent Electrothermal SPICE Netlists from 3D Electrothermal Field Models.
EuroSimE 2016.
Konferenzveröffentlichung, Bibliographie

Casper, Thorben ; Römer, Ulrich ; Schöps, Sebastian (2016)
Efficient Evaluation of Bond Wire Fusing Probabilities.
SIAM Conference on Uncertainty Quantification 2016.
Konferenzveröffentlichung, Bibliographie

Casper, Thorben ; De Gersem, Herbert ; Gillon, Renaud ; Gotthans, Tomas ; Kratochvíl, Tomáš ; Meuris, Peter ; Schöps, Sebastian
Hrsg.: Fanucci, Luca ; Teich, Jürgen (2016)
Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries.
In: Proceedings of the 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE)
Buchkapitel, Bibliographie

Casper, Thorben ; De Gersem, Herbert ; Gotthans, Tomas ; Schoenmaker, Wim ; Schöps, Sebastian ; Wieers, Aarnout (2016)
Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries.
DATE 2016.
Konferenzveröffentlichung, Bibliographie

Casper, Thorben ; De Gersem, Herbert ; Schöps, Sebastian (2016)
Automatic Generation of Equivalent Electrothermal SPICE Netlists from 3D Electrothermal Field Models.
In: 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Buchkapitel, Bibliographie

Maten, E. Jan W. ter ; Schöps, Sebastian ; Duque, David ; Casper, Thorben ; De Gersem, Herbert ; Römer, Ulrich (2016)
Nanoelectronic COupled problems solutions - nanoCOPS: modelling, multirate, model order reduction, uncertainty quantification, fast fault simulation.
In: Journal of Mathematics in Industry, 7 (2)
Artikel, Bibliographie

Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert (2015)
Electrothermal co-simulation of device structures in electronics.
YIC GACM 2015 — 3rd ECCOMAS Young Investigators Conference.
Konferenzveröffentlichung, Bibliographie