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Number of items: 27.

Hirmer, Katrin ; Hofmann, Klaus ; Casper, Thorben ; Schöps, Sebastian (2019):
3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by Measurements.
In: 2019 Kleinheubach Conference, Miltenberg, ISBN 978-3-948571-00-9,
[Book Section]

Casper, Thorben ; Duque, David José ; Schöps, Sebastian ; De Gersem, Herbert (2019):
Automated Generation of Netlists from Electrothermal Field Models.
In: Mathematics in Industry, 29, In: Nanoelectronic Coupled Problems Solutions, pp. 93-113, Cham, Springer, ISBN 978-3-030-30725-7,
DOI: 10.1007/978-3-030-30726-4_5,
[Book Section]

Duque, David José ; Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert ; Römer, Ulrich ; Gillon, Renaud ; Wieers, Aarnout ; Kratochvíl, Tomáš ; Götthans, Tomáš ; Meuris, Peter (2019):
Bond Wire Models.
In: Mathematics in Industry, 29, In: Nanoelectronic Coupled Problems Solutions, pp. 43-68, Cham, Springer, ISBN 978-3-030-30725-7,
DOI: 10.1007/978-3-030-30726-4_3,
[Book Section]

Casper, Thorben ; Römer, Ulrich ; De Gersem, Herbert ; Schöps, Sebastian (2019):
Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging.
In: Computers & Mathematics with Applications, ISSN 0898-1221,
DOI: 10.1016/j.camwa.2019.10.009,
[Article]

Casper, Thorben (2019):
Electrothermal Field and Circuit Simulation of Thin Wires and Evaluation of Failure Probabilities.
Darmstadt, Technische Universität,
[Ph.D. Thesis]

Casper, Thorben ; Duque, David ; Schöps, Sebastian ; De Gersem, Herbert (2019):
Automated Netlist Generation for 3D Electrothermal and Electromagnetic Field Problems.
In: arXiv, In: Journal of Computational Electronics, 1809.08588, [Article]

Krimm, Alexander ; Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert ; Chamoin, Ludovic (2019):
Proper Generalized Decomposition of Parameterized Electrothermal Problems Discretized by the Finite Integration Technique.
In: IEEE Transactions on Magnetics, 55 (6), IEEE, ISSN 0018-9464,
DOI: 10.1109/TMAG.2019.2907223,
[Article]

Casper, Thorben ; Duque, David ; Schöps, Sebastian ; De Gersem, Herbert (2018):
Electric Circuits for Exact Representations of Spatially Discretised Electrothermal and Electromagnetic 3D Field Problems.
Maxwell in Motion, Workshop on Advances in Electromagnetic Research — KWT 2018, Rietzlern, Austria, [Conference or Workshop Item]

Loukrezis, Dimitrios ; Römer, Ulrich ; Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert (2018):
High Dimensional Uncertainty Quantification for an Electrothermal Field Problem using Stochastic Collocation on Sparse Grids and Tensor Train Decomposition.
In: International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, 31 (2), ISSN 1099-1204,
[Article]

Loukrezis, Dimitrios ; Römer, Ulrich ; Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert (2018):
High-dimensional uncertainty quantification for an electrothermal field problem using stochastic collocation on sparse grids and tensor train decompositions.
In: International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, 2018, pp. 1-8. [Article]

Bigalke, Steve ; Lienig, Jens ; Casper, Thorben ; Schöps, Sebastian
Gola, Alberto (ed.) (2018):
Increasing EM Robustness of Placement and Routing Solutions based on Layout-Driven Discretization.
In: 14th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME 2018), IEEE, DOI: 10.1109/PRIME.2018.8430323,
[Book Section]

Casper, Thorben (2017):
1D-3D Coupling to Include Thin Wires in Electrothermal Simulations Using FIT.
Workshop on Advances in Electromagnetic Research — KWT 2017, [Conference or Workshop Item]

Casper, Thorben ; Römer, Ulrich ; Schöps, Sebastian
Dyczij-Edlinger, Romanus (ed.) (2017):
Determining Bond Wire Temperatures in Electronic Devices by a 1D-3D Coupling Approach.
Miltenberg, URSI Kleinheubacher Tagung (KHB 2017), Miltenberg, [Conference or Workshop Item]

Casper, Thorben ; Römer, Ulrich ; Schöps, Sebastian
Schäfer, Michael (ed.) (2017):
On the Simulation of Thin Wires in a Coupled 1D-3D Setting.
Darmstadt, Germany, 4th International Conference on Computational Engineering (ICCE 2017), Darmstadt, Germany, [Conference or Workshop Item]

Casper, Thorben ; Römer, Ulrich ; Schöps, Sebastian
Jung, Hyun-Kyo (ed.) (2017):
An Electrothermal 1D-3D Coupling Approach for Thin Wires in Microelectronic Chip Packages.
Daejeon, Korea, 21th Conference on the Computation of Electromagnetic Fields, Daejeon, Korea, [Conference or Workshop Item]

Römer, Ulrich ; Casper, Thorben ; Schöps, Sebastian (2017):
Uncertainty Quantification for a Singular Electrothermal Coupled Problem with Error Control.
Rhodes Island, Greece, UNCECOMP 2017, Rhodes Island, Greece, [Conference or Workshop Item]

Casper, Thorben ; Duque, David ; Schöps, Sebastian ; De Gersem, Herbert (2016):
Equivalent Netlist Extraction for Electrothermal and Electromagnetic Problems Discretized by the Finite Integration Technique.
11th Conference on Scientific Computing in Electrical Engineering (SCEE 2016), [Conference or Workshop Item]

Duque, David ; Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert
Wasenmüller, Uwe ; Sauer-Greff, Wolfgang (eds.) (2016):
A Circuit-Based Approach for the Solution of Electrothermal and Electromagnetic Problems.
Miltenberg, URSI Kleinheubacher Tagung (KHB 2016), Miltenberg, [Conference or Workshop Item]

Casper, Thorben ; Römer, Ulrich ; Schöps, Sebastian (2016):
Determination of Bond Wire Failure Probabilities in Microelectronic Packages.
pp. 39-44, Budapest, 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Budapest, 21-23 Sept. 2016, DOI: 10.1109/THERMINIC.2016.7748645,
[Conference or Workshop Item]

Loukrezis, Dimitrios ; Römer, Ulrich ; Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert (2016):
Application of High Dimensional Uncertainty Quantification Methods to Electrothermal Field Problems.
10th International Symposium on Electric and Magnetic Fields (EMF 2016), [Conference or Workshop Item]

Casper, Thorben ; De Gersem, Herbert ; Schöps, Sebastian (2016):
Automatic Generation of Equivalent Electrothermal SPICE Netlists from 3D Electrothermal Field Models.
EuroSimE 2016, [Conference or Workshop Item]

Casper, Thorben ; Römer, Ulrich ; Schöps, Sebastian (2016):
Efficient Evaluation of Bond Wire Fusing Probabilities.
SIAM Conference on Uncertainty Quantification 2016, [Conference or Workshop Item]

Casper, Thorben ; De Gersem, Herbert ; Gillon, Renaud ; Gotthans, Tomas ; Kratochvíl, Tomáš ; Meuris, Peter ; Schöps, Sebastian
Fanucci, Luca ; Teich, Jürgen (eds.) (2016):
Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries.
In: Proceedings of the 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE), pp. 1297-1302, IEEE, ISBN 978-3-9815370-6-2,
[Book Section]

Casper, Thorben ; De Gersem, Herbert ; Gotthans, Tomas ; Schoenmaker, Wim ; Schöps, Sebastian ; Wieers, Aarnout (2016):
Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries.
DATE 2016, [Conference or Workshop Item]

Casper, Thorben ; De Gersem, Herbert ; Schöps, Sebastian (2016):
Automatic Generation of Equivalent Electrothermal SPICE Netlists from 3D Electrothermal Field Models.
In: 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), pp. 1-8, [Book Section]

Maten, E. Jan W. ter ; Schöps, Sebastian ; Duque, David ; Casper, Thorben ; De Gersem, Herbert ; Römer, Ulrich (2016):
Nanoelectronic COupled problems solutions - nanoCOPS: modelling, multirate, model order reduction, uncertainty quantification, fast fault simulation.
In: Journal of Mathematics in Industry, 7 (2), Springer, ISSN 2190-5983,
[Article]

Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert (2015):
Electrothermal co-simulation of device structures in electronics.
YIC GACM 2015 — 3rd ECCOMAS Young Investigators Conference, [Conference or Workshop Item]

This list was generated on Tue Jan 18 07:22:12 2022 CET.