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Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries

Casper, Thorben ; De Gersem, Herbert ; Gillon, Renaud ; Gotthans, Tomas ; Kratochvíl, Tomáš ; Meuris, Peter ; Schöps, Sebastian
Fanucci, Luca ; Teich, Jürgen (eds.) (2016):
Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries.
In: Proceedings of the 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE), pp. 1297-1302, IEEE, ISBN 978-3-9815370-6-2,
[Book Section]

Item Type: Book Section
Erschienen: 2016
Editors: Fanucci, Luca ; Teich, Jürgen
Creators: Casper, Thorben ; De Gersem, Herbert ; Gillon, Renaud ; Gotthans, Tomas ; Kratochvíl, Tomáš ; Meuris, Peter ; Schöps, Sebastian
Title: Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries
Language: German
Title of Book: Proceedings of the 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE)
Publisher: IEEE
ISBN: 978-3-9815370-6-2
Divisions: 18 Department of Electrical Engineering and Information Technology
18 Department of Electrical Engineering and Information Technology > Institute of Electromagnetic Field Theory (from 01.01.2019 renamed Institute for Accelerator Science and Electromagnetic Fields)
18 Department of Electrical Engineering and Information Technology > Institute of Electromagnetic Field Theory (from 01.01.2019 renamed Institute for Accelerator Science and Electromagnetic Fields) > Computational Engineering (from 01.01.2019 renamed Computational Electromagnetics)
Exzellenzinitiative
Exzellenzinitiative > Graduate Schools
Exzellenzinitiative > Graduate Schools > Graduate School of Computational Engineering (CE)
Event Title: Proceedings of the 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE)
Date Deposited: 10 Apr 2017 21:51
Official URL: http://ieeexplore.ieee.org/document/7459510
Additional Information:

TEMF-Pub-DB TEMF002530

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