Casper, Thorben and Römer, Ulrich and De Gersem, Herbert and Schöps, Sebastian (2019):
Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging.
In: Computers & Mathematics with Applications, ISSN 0898-1221,
DOI: 10.1016/j.camwa.2019.10.009,
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- Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging. (deposited 18 Nov 2019 14:17) [Currently Displayed]
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