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Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging

Casper, Thorben and Römer, Ulrich and De Gersem, Herbert and Schöps, Sebastian (2019):
Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging.
In: Computers & Mathematics with Applications, ISSN 0898-1221, DOI: 10.1016/j.camwa.2019.10.009,
[Online-Edition: https://www.sciencedirect.com/science/article/pii/S089812211...],
[Article]

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Item Type: Article
Erschienen: 2019
Creators: Casper, Thorben and Römer, Ulrich and De Gersem, Herbert and Schöps, Sebastian
Title: Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging
Language: English
Journal or Publication Title: Computers & Mathematics with Applications
Divisions: 18 Department of Electrical Engineering and Information Technology
18 Department of Electrical Engineering and Information Technology > Institute for Accelerator Science and Electromagnetic Fields > Computational Electromagnetics
18 Department of Electrical Engineering and Information Technology > Institute for Accelerator Science and Electromagnetic Fields
Exzellenzinitiative
Exzellenzinitiative > Graduate Schools
Exzellenzinitiative > Graduate Schools > Graduate School of Computational Engineering (CE)
Date Deposited: 18 Nov 2019 14:17
DOI: 10.1016/j.camwa.2019.10.009
Official URL: https://www.sciencedirect.com/science/article/pii/S089812211...
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