TU Darmstadt / ULB / TUbiblio

3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by Measurements

Hirmer, Katrin and Hofmann, Klaus and Casper, Thorben and Schöps, Sebastian (2019):
3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by Measurements.
In: 2019 Kleinheubach Conference, Miltenberg, [Online-Edition: https://ieeexplore.ieee.org/document/8890092],
[Book Section]

This is the latest version of this item.

Abstract

This paper proposes 3D field simulation models for different designs of integrated bond wire on-chip inductors. To validate the simulation models, prototypes for three designs with air and ferrite cores are manufactured and measured. For air core inductors, high agreement between simulation and measurement is obtained. For ferrite core inductors, accurate models require an exact characterization of the ferrite material. These models enable the prediction of magnetic field influences on underlying integrated circuits.

Item Type: Book Section
Erschienen: 2019
Creators: Hirmer, Katrin and Hofmann, Klaus and Casper, Thorben and Schöps, Sebastian
Title: 3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by Measurements
Language: English
Abstract:

This paper proposes 3D field simulation models for different designs of integrated bond wire on-chip inductors. To validate the simulation models, prototypes for three designs with air and ferrite cores are manufactured and measured. For air core inductors, high agreement between simulation and measurement is obtained. For ferrite core inductors, accurate models require an exact characterization of the ferrite material. These models enable the prediction of magnetic field influences on underlying integrated circuits.

Title of Book: 2019 Kleinheubach Conference
Place of Publication: Miltenberg
ISBN: 978-3-948571-00-9
Divisions: 18 Department of Electrical Engineering and Information Technology
18 Department of Electrical Engineering and Information Technology > Institute for Accelerator Science and Electromagnetic Fields > Computational Electromagnetics
18 Department of Electrical Engineering and Information Technology > Institute of Electromagnetic Field Theory (from 01.01.2019 renamed Institute for Accelerator Science and Electromagnetic Fields)
18 Department of Electrical Engineering and Information Technology > Institute of Electromagnetic Field Theory (from 01.01.2019 renamed Institute for Accelerator Science and Electromagnetic Fields) > Computational Engineering (from 01.01.2019 renamed Computational Electromagnetics)
18 Department of Electrical Engineering and Information Technology > Institute for Accelerator Science and Electromagnetic Fields
Exzellenzinitiative
Exzellenzinitiative > Graduate Schools
Exzellenzinitiative > Graduate Schools > Graduate School of Computational Engineering (CE)
Event Title: URSI Kleinheubacher Tagung (KHB 2019)
Event Location: Miltenberg
Event Dates: September 23.–25., 2019
Date Deposited: 18 Dec 2019 07:35
Official URL: https://ieeexplore.ieee.org/document/8890092
Related URLs:
Export:
Suche nach Titel in: TUfind oder in Google

Available Versions of this Item

  • 3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by Measurements. (deposited 18 Dec 2019 07:35) [Currently Displayed]
Send an inquiry Send an inquiry

Options (only for editors)

View Item View Item