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Number of items: 5.

Duque, David José and Casper, Thorben and Schöps, Sebastian and De Gersem, Herbert and Römer, Ulrich and Gillon, Renaud and Wieers, Aarnout and Kratochvíl, Tomáš and Götthans, Tomáš and Meuris, Peter (2019):
Bond Wire Models.
In: Mathematics in Industry, 29, In: Nanoelectronic Coupled Problems Solutions, pp. 43-68, Cham, Springer, ISBN 978-3-030-30725-7,
DOI: 10.1007/978-3-030-30726-4_3,
[Book Section]

Duque, David and Schöps, Sebastian and Wieers, Aarnout Russo, Giovanni and Capasso, Vincenzo and Nicosia, Giuseppe (eds.) (2017):
Fast and Reliable Simulations of the Heating of Bond Wires.
In: Mathematics in Industry, 22, In: Progress in Industrial Mathematics at ECMI 2014, Berlin, Springer, ISBN 978-3-319-23412-0,
DOI: 10.1007/978-3-319-23413-7_114,
[Book Section]

Casper, Thorben and De Gersem, Herbert and Gotthans, Tomas and Schoenmaker, Wim and Schöps, Sebastian and Wieers, Aarnout (2016):
Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries.
DATE 2016, [Conference or Workshop Item]

Günther, Michael and Putek, Piotr and ter Maten, E. Jan W. and Pulch, Roland and Schoenmaker, Wim and Meuris, Peter and Wieers, Aarnout and Deleu, Frederik (2015):
Uncertainty Quantification in Electro-Thermal Coupled Problems based on a Power Transistor Device.
MATHMOD 2015 - 8th Vienna International Conference on Mathematical Modelling, [Conference or Workshop Item]

Duque, David and Schöps, Sebastian and De Gersem, Herbert and Wieers, Aarnout (2014):
nanoCOPS: Analytical Approach for Estimating the Heating of Bond-wires.
In: ECMI Newsletter 56, 56, pp. 70-71. [Article]

This list was generated on Tue Jun 15 01:39:40 2021 CEST.