2019

Duque, David José ; Casper, Thorben ; Schöps, Sebastian ; De Gersem, Herbert ; Römer, Ulrich ; Gillon, Renaud ; Wieers, Aarnout ; Kratochvíl, Tomáš ; Götthans, Tomáš ; Meuris, Peter (2019)
Bond Wire Models.
In: Nanoelectronic Coupled Problems Solutions
doi: 10.1007/978-3-030-30726-4_3
Book Section

2017

Duque, David ; Schöps, Sebastian ; Wieers, Aarnout
eds.: Russo, Giovanni ; Capasso, Vincenzo ; Nicosia, Giuseppe (2017)
Fast and Reliable Simulations of the Heating of Bond Wires.
In: Progress in Industrial Mathematics at ECMI 2014
doi: 10.1007/978-3-319-23413-7_114
Book Section

2016

Casper, Thorben ; De Gersem, Herbert ; Gotthans, Tomas ; Schoenmaker, Wim ; Schöps, Sebastian ; Wieers, Aarnout (2016)
Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries.
DATE 2016.
Conference or Workshop Item

2015

Günther, Michael ; Putek, Piotr ; Maten, E. Jan W. ter ; Pulch, Roland ; Schoenmaker, Wim ; Meuris, Peter ; Wieers, Aarnout ; Deleu, Frederik (2015)
Uncertainty Quantification in Electro-Thermal Coupled Problems based on a Power Transistor Device.
MATHMOD 2015 - 8th Vienna International Conference on Mathematical Modelling.
Conference or Workshop Item

2014

Duque, David ; Schöps, Sebastian ; De Gersem, Herbert ; Wieers, Aarnout (2014)
nanoCOPS: Analytical Approach for Estimating the Heating of Bond-wires.
In: ECMI Newsletter 56, 56
Article