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Number of items: 3.

Duque, David José and Casper, Thorben and Schöps, Sebastian and De Gersem, Herbert and Römer, Ulrich and Gillon, Renaud and Wieers, Aarnout and Kratochvíl, Tomáš and Götthans, Tomáš and Meuris, Peter (2019):
Bond Wire Models.
In: Mathematics in Industry, 29, In: Nanoelectronic Coupled Problems Solutions, pp. 43-68, Cham, Springer, ISBN 978-3-030-30725-7,
DOI: 10.1007/978-3-030-30726-4_3,
[Book Section]

Casper, Thorben and De Gersem, Herbert and Gillon, Renaud and Gotthans, Tomas and Kratochvíl, Tomáš and Meuris, Peter and Schöps, Sebastian Fanucci, Luca and Teich, Jürgen (eds.) (2016):
Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries.
In: Proceedings of the 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE), pp. 1297-1302, IEEE, ISBN 978-3-9815370-6-2,
[Book Section]

Günther, Michael and Putek, Piotr and ter Maten, E. Jan W. and Pulch, Roland and Schoenmaker, Wim and Meuris, Peter and Wieers, Aarnout and Deleu, Frederik (2015):
Uncertainty Quantification in Electro-Thermal Coupled Problems based on a Power Transistor Device.
MATHMOD 2015 - 8th Vienna International Conference on Mathematical Modelling, [Conference or Workshop Item]

This list was generated on Tue Jun 15 00:40:02 2021 CEST.