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Number of items: 2.

Brandt, Michael and Krozer, and Schüßler, and Lin, and Simon, and Vogt, and Rodriguez, and Parmeggiani, and Grajal, (1998):
Application of transmission line pulsed (TLP) stress for thermal and reliability characterisation of compound semiconductor devices.
In: Reliability Center of Japan (RCJ) Symposium <1998, Tokyo>: Proceedings, [Conference or Workshop Item]

Brandt, Michael and Schüßler, and Parmeggiani, and Lin, and Simon, and Hartnagel, (1997):
Thermal simulation and characterisation of the reliability of terahertz Schottky diodes.
In: European Symposium of Electron Devices, Failure Physics and Analysis <8, 1997, Arcachon, France>: Proceedings. S. 1663-1666, [Conference or Workshop Item]

This list was generated on Sat Aug 17 01:05:21 2019 CEST.