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Brandt, Michael and Krozer, and Schüßler, and Lin, and Simon, and Vogt, and Rodriguez, and Parmeggiani, and Grajal, (1998):
Application of transmission line pulsed (TLP) stress for thermal and reliability characterisation of compound semiconductor devices.
In: Reliability Center of Japan (RCJ) Symposium <1998, Tokyo>: Proceedings, [Conference or Workshop Item]

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