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Application of transmission line pulsed (TLP) stress for thermal and reliability characterisation of compound semiconductor devices

Brandt, Michael and Krozer, and Schüßler, and Lin, and Simon, and Vogt, and Rodriguez, and Parmeggiani, and Grajal, (1998):
Application of transmission line pulsed (TLP) stress for thermal and reliability characterisation of compound semiconductor devices.
In: Reliability Center of Japan (RCJ) Symposium <1998, Tokyo>: Proceedings, [Conference or Workshop Item]

Item Type: Conference or Workshop Item
Erschienen: 1998
Creators: Brandt, Michael and Krozer, and Schüßler, and Lin, and Simon, and Vogt, and Rodriguez, and Parmeggiani, and Grajal,
Title: Application of transmission line pulsed (TLP) stress for thermal and reliability characterisation of compound semiconductor devices
Language: English
Series Name: Reliability Center of Japan (RCJ) Symposium <1998, Tokyo>: Proceedings
Divisions: 18 Department of Electrical Engineering and Information Technology
Date Deposited: 19 Nov 2008 16:20
License: [undefiniert]
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