Latsch, Bastian ; Schäfer, Niklas ; Grimmer, Martin ; Dali, Omar Ben ; Mohseni, Omid ; Bleichner, Niklas ; Altmann, Alexander A. ; Schaumann, Stephan ; Wolf, Sebastian I. ; Seyfarth, André ; Beckerle, Philipp ; Kupnik, Mario (2024)
3D-Printed Piezoelectric PLA-Based Insole for Event Detection in Gait Analysis.
In: IEEE Sensors Journal
doi: 10.1109/JSEN.2024.3416847
Artikel, Bibliographie

Chadda, Romol ; Dali, Omar Ben ; Latsch, Bastian ; Sundaralingam, Esan ; Kupnik, Mario (2023)
3D-Printed Strain Gauges Based on Conductive Filament for Experimental Stress Analysis.
IEEE SENSORS 2023. Vienna, Austria (29.10.-01.11.2023)
doi: 10.1109/SENSORS56945.2023.10325276
Konferenzveröffentlichung, Bibliographie

Latsch, Bastian ; Dali, Omar Ben ; Chadda, Romol ; Schäfer, Niklas ; Altmann, Alexander A. ; Grimmer, Martin ; Beckerle, Philipp ; Kupnik, Mario (2023)
Low Creep 3D-Printed Piezoresistive Force Sensor for Structural Integration.
IEEE SENSORS 2023. Vienna, Austria (29.10.-01.11.2023)
doi: 10.1109/SENSORS56945.2023.10325114
Konferenzveröffentlichung, Bibliographie

Chadda, Romal ; Link, Martin ; Engel, Tim ; Hartmann, Claas ; Dali, Omar Ben ; Probst, Johanna ; Merschroth, Holger ; Abele, Eberhard ; Weigold, Matthias ; Kupnik, Mario (2022)
Evaluation of Additively Manufactured Parts in Disruptive Manner as Deformation Elements for Structural Integrated Force Sensors.
In: IEEE Sensors Journal, 22 (20)
doi: 10.1109/JSEN.2022.3205172
Artikel, Bibliographie

Seggern, Heinz von ; Zhukov, Sergey ; Dali, Omar Ben ; Hartmann, Claas ; Sessler, Gerhard M. ; Kupnik, Mario (2022)
Highly Efficient Piezoelectrets through Ultra-Soft Elastomeric Spacers.
In: Polymers, 2022, 13 (21)
doi: 10.26083/tuprints-00019969
Artikel, Zweitveröffentlichung, Verlagsversion