Latsch, Bastian ; Schäfer, Niklas ; Grimmer, Martin ; Dali, Omar Ben ; Mohseni, Omid ; Bleichner, Niklas ; Altmann, Alexander A. ; Schaumann, Stephan ; Wolf, Sebastian I. ; Seyfarth, André ; Beckerle, Philipp ; Kupnik, Mario (2024)
3D-Printed Piezoelectric PLA-Based Insole for Event Detection in Gait Analysis.
In: IEEE Sensors Journal, 24 (16)
doi: 10.1109/JSEN.2024.3416847
Artikel, Bibliographie

Latsch, Bastian ; Dali, Omar Ben ; Hench, Benedikt ; Chadda, Romol ; Sellami, Youssef ; Altmann, Alexander A. ; Schäfer, Niklas ; Seiler, Julian ; Kupnik, Mario (2024)
Hybrid Sensor Insole for Wearable Ballistocardiography in Remote Health Monitoring.
h IEEE International Conference on Flexible and Printable Sensors and Systems (IEEE FLEPS 2024). Tampere, Finland (30.06.2024 - 03.07.2024)
doi: 10.1109/FLEPS61194.2024.10603814
Konferenzveröffentlichung, Bibliographie

Hu, Qianqian ; Zhang, Tongyan ; Sessler, Gerhard M. ; Seggern, Heinz von ; Altmann, Alexander A. ; Kupnik, Mario ; Shi, Zhiming ; Zhang, Xiaoqing (2024)
Longitudinal and transverse piezoelectric effects of ferroelectret metamaterials with positive and negative Poisson's ratios.
In: Applied Physics Letters, 124 (14)
doi: 10.1063/5.0196696
Artikel, Bibliographie

Latsch, Bastian ; Dali, Omar Ben ; Chadda, Romol ; Schäfer, Niklas ; Altmann, Alexander A. ; Grimmer, Martin ; Beckerle, Philipp ; Kupnik, Mario (2023)
Low Creep 3D-Printed Piezoresistive Force Sensor for Structural Integration.
IEEE SENSORS 2023. Vienna, Austria (29.10.-01.11.2023)
doi: 10.1109/SENSORS56945.2023.10325114
Konferenzveröffentlichung, Bibliographie

Sellami, Youssef ; Ben Dali, Omar ; Chadda, Romol ; Zhukov, Sergey ; Guermazi, Mahdi ; Altmann, Alexander A. ; Seggern, Heinz von ; Latsch, Bastian ; Schäfer, Niklas ; Kupnik, Mario (2023)
Piezoelectret Sensors from Direct 3D-Printing onto Bulk Films.
IEEE SENSORS 2023. Vienna, Austria (29.10.-01.11.2023)
doi: 10.1109/SENSORS56945.2023.10324862
Konferenzveröffentlichung, Bibliographie