2024

Latsch, Bastian ; Schäfer, Niklas ; Grimmer, Martin ; Dali, Omar Ben ; Mohseni, Omid ; Bleichner, Niklas ; Altmann, Alexander A. ; Schaumann, Stephan ; Wolf, Sebastian I. ; Seyfarth, André ; Beckerle, Philipp ; Kupnik, Mario (2024)
3D-Printed Piezoelectric PLA-Based Insole for Event Detection in Gait Analysis.
In: IEEE Sensors Journal, 24 (16)
doi: 10.1109/JSEN.2024.3416847
Artikel, Bibliographie

Latsch, Bastian ; Dali, Omar Ben ; Hench, Benedikt ; Chadda, Romol ; Sellami, Youssef ; Altmann, Alexander A. ; Schäfer, Niklas ; Seiler, Julian ; Kupnik, Mario (2024)
Hybrid Sensor Insole for Wearable Ballistocardiography in Remote Health Monitoring.
h IEEE International Conference on Flexible and Printable Sensors and Systems (IEEE FLEPS 2024). Tampere, Finland (30.06.2024 - 03.07.2024)
doi: 10.1109/FLEPS61194.2024.10603814
Konferenzveröffentlichung, Bibliographie

Schäfer, Niklas ; Latsch, Bastian ; Schaumann, Sarah ; Graffe, S. ; Mohseni, Omid ; Seiler, J. ; Dali, Omar Ben ; Grimmer, M. (2024)
Wearable Ferroelectret Sensors for Muscle Activity Measurements.
2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium. Taipei, Taiwan (22.09.2024-26.09.2024)
Konferenzveröffentlichung, Bibliographie

2023

Ma, Xingchen ; Zhukov, Sergey ; Seggern, Heinz von ; Sessler, Gerhard M. ; Dali, Omar Ben ; Kupnik, Mario ; Dai, Ying ; He, Pengfei ; Zhang, Xiaoqing (2023)
Biodegradable and bioabsorbable polylactic acid ferroelectrets with prominent piezoelectric activity.
In: Advanced Electronic Materials, 9 (3)
doi: 10.1002/aelm.202201070
Artikel, Bibliographie

Chadda, Romol ; Dali, Omar Ben ; Latsch, Bastian ; Sundaralingam, Esan ; Kupnik, Mario (2023)
3D-Printed Strain Gauges Based on Conductive Filament for Experimental Stress Analysis.
IEEE SENSORS 2023. Vienna, Austria (29.10.-01.11.2023)
doi: 10.1109/SENSORS56945.2023.10325276
Konferenzveröffentlichung, Bibliographie

Latsch, Bastian ; Dali, Omar Ben ; Chadda, Romol ; Schäfer, Niklas ; Altmann, Alexander A. ; Grimmer, Martin ; Beckerle, Philipp ; Kupnik, Mario (2023)
Low Creep 3D-Printed Piezoresistive Force Sensor for Structural Integration.
IEEE SENSORS 2023. Vienna, Austria (29.10.-01.11.2023)
doi: 10.1109/SENSORS56945.2023.10325114
Konferenzveröffentlichung, Bibliographie

2022

Chadda, Romal ; Link, Martin ; Engel, Tim ; Hartmann, Claas ; Dali, Omar Ben ; Probst, Johanna ; Merschroth, Holger ; Abele, Eberhard ; Weigold, Matthias ; Kupnik, Mario (2022)
Evaluation of Additively Manufactured Parts in Disruptive Manner as Deformation Elements for Structural Integrated Force Sensors.
In: IEEE Sensors Journal, 22 (20)
doi: 10.1109/JSEN.2022.3205172
Artikel, Bibliographie

Seggern, Heinz von ; Zhukov, Sergey ; Dali, Omar Ben ; Hartmann, Claas ; Sessler, Gerhard M. ; Kupnik, Mario (2022)
Highly Efficient Piezoelectrets through Ultra-Soft Elastomeric Spacers.
In: Polymers, 13 (21)
doi: 10.3390/polym13213751
Artikel, Bibliographie

2020

Zhukov, Sergey ; Ma, Xingchen ; Seggern, Heinz von ; Sessler, Gerhard M. ; Dali, Omar Ben ; Kupnik, Mario ; Zhang, Xiaoqing (2020)
Biodegradable cellular polylactic acid ferroelectrets with strong longitudinal and transverse piezoelectricity.
In: Applied Physics Letters, 117 (11)
doi: 10.1063/5.0023153
Artikel, Bibliographie