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Casper, Thorben and De Gersem, Herbert and Gillon, Renaud and Gotthans, Tomas and Kratochvíl, Tomáš and Meuris, Peter and Schöps, Sebastian Fanucci, Luca and Teich, Jürgen (eds.) (2016):
Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries.
In: Proceedings of the 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE), IEEE, pp. 1297-1302, [Online-Edition: http://ieeexplore.ieee.org/document/7459510],
[Book Section]

Stoettinger, Marc and Madlener, Felix and Huss, Sorin Platzner, Marco and Teich, Jürgen and Wehn, Norbert (eds.) (2009):
Dynamically Reconfigurable Systems - Architectures, Design Methods and Applications.
Springer, pp. 305-321, [Book Section]

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