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Zhang, Hui (2015)
Charakterisierung thermischer Einflüsse von Interfacematerialien in LED-Packages.
Technische Universität Darmstadt
Masterarbeit, Bibliographie
Englisch
Schmidt, Annika ; Zhang, Hui ; Schmitt, Stephanie ; Rausch, Cathia ; Popp, Oliver ; Chen, Jiaxuan ; Cmarko, Dusan ; Butter, Falk ; Dittmar, Gunnar ; Lermyte, Frederik ; Cardoso, M. Cristina (2024)
The proteomic composition and organization of constitutive heterochromatin in mouse tissues.
In: Cells, 13 (2)
doi: 10.3390/cells13020139
Artikel, Bibliographie
Zhang, Hui ; Qin, Weihua ; Romero, Hector ; Leonhardt, Heinrich ; Cardoso, M. Cristina (2023)
Heterochromatin organization and phase separation.
In: Nucleus (Austin, Tex.), 14 (1)
doi: 10.1080/19491034.2022.2159142
Artikel, Bibliographie
Zhang, Hui ; Romero, Hector ; Schmidt, Annika ; Gagova, Katalina ; Qin, Weihua ; Bertulat, Bianca ; Lehmkuhl, Anne ; Milden, Manuela ; Eck, Malte ; Meckel, Tobias ; Leonhardt, Heinrich ; Cardoso, M. Cristina (2022)
MeCP2-induced heterochromatin organization is driven by oligomerization-based liquid–liquid phase separation and restricted by DNA methylation.
In: Nucleus (Austin, Tex.), 13 (1)
doi: 10.1080/19491034.2021.2024691
Artikel, Bibliographie
Schmidt, Annika ; Frei, Jana ; Poetsch, Ansgar ; Chittka, Alexandra ; Zhang, Hui ; Aßmann, Chris ; Lehmkuhl, Anne ; Bauer, Uta-Maria ; Nuber, Ulrike A. ; Cardoso, M. Cristina (2022)
MeCP2 heterochromatin organization is modulated by arginine methylation and serine phosphorylation.
In: Frontiers in cell and developmental biology, 10
doi: 10.3389/fcell.2022.941493
Artikel, Bibliographie
Zhang, Hui (2022)
Phase Separation of the Methyl-CpG-Binding Domain (MBD) Protein Family Underlies Heterochromatin Organization.
Technische Universität Darmstadt
doi: 10.26083/tuprints-00020494
Dissertation, Erstveröffentlichung, Verlagsversion
Schmidt, Annika ; Zhang, Hui ; Cardoso, M. Cristina (2020)
MeCP2 and Chromatin Compartmentalization.
In: Cells, 9 (4)
Artikel, Bibliographie
Zhang, Hui ; Wagner, Max ; Khanh, Tran Quoc (2015)
Reading between the thermal lines - New dielectric materials for LED-packages.
In: Engineering Edge, 4 (2)
Artikel, Bibliographie