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Reading between the thermal lines - New dielectric materials for LED-packages

Zhang, Hui ; Wagner, Max ; Khanh, Tran Quoc :
Reading between the thermal lines - New dielectric materials for LED-packages.
In: Engineering Edge, 4 (2) pp. 64-66.
[Artikel], (2015)

Kurzbeschreibung (Abstract)

One of the main aims in electronic packaging is a good heat transport away from the device, downwards through the package into the board. The LED chip is connected electrically at its top and bottom. That is why there is a need to separate the electric circuit from the metal board. This is achieved by an insulator layer, which is neither electrically nor thermally very conductive. In this study the thermal behavior of new dielectric materials in LED packages are investigated. Furthermore the influence of geometric parameters of the electrical layout has been tested by measurements and simulations.

Typ des Eintrags: Artikel
Erschienen: 2015
Autor(en): Zhang, Hui ; Wagner, Max ; Khanh, Tran Quoc
Titel: Reading between the thermal lines - New dielectric materials for LED-packages
Sprache: Englisch
Kurzbeschreibung (Abstract):

One of the main aims in electronic packaging is a good heat transport away from the device, downwards through the package into the board. The LED chip is connected electrically at its top and bottom. That is why there is a need to separate the electric circuit from the metal board. This is achieved by an insulator layer, which is neither electrically nor thermally very conductive. In this study the thermal behavior of new dielectric materials in LED packages are investigated. Furthermore the influence of geometric parameters of the electrical layout has been tested by measurements and simulations.

Titel der Zeitschrift, Zeitung oder Schriftenreihe: Engineering Edge
Band: 4
(Heft-)Nummer: 2
Fachbereich(e)/-gebiet(e): 18 Fachbereich Elektrotechnik und Informationstechnik > Institut für Elektromechanische Konstruktionen > Lichttechnik
18 Fachbereich Elektrotechnik und Informationstechnik > Institut für Elektromechanische Konstruktionen
18 Fachbereich Elektrotechnik und Informationstechnik
Hinterlegungsdatum: 03 Mai 2016 16:36
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