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Reading between the thermal lines - New dielectric materials for LED-packages

Zhang, Hui and Wagner, Max and Khanh, Tran Quoc (2015):
Reading between the thermal lines - New dielectric materials for LED-packages.
In: Engineering Edge, pp. 64-66, 4, (2), [Article]

Abstract

One of the main aims in electronic packaging is a good heat transport away from the device, downwards through the package into the board. The LED chip is connected electrically at its top and bottom. That is why there is a need to separate the electric circuit from the metal board. This is achieved by an insulator layer, which is neither electrically nor thermally very conductive. In this study the thermal behavior of new dielectric materials in LED packages are investigated. Furthermore the influence of geometric parameters of the electrical layout has been tested by measurements and simulations.

Item Type: Article
Erschienen: 2015
Creators: Zhang, Hui and Wagner, Max and Khanh, Tran Quoc
Title: Reading between the thermal lines - New dielectric materials for LED-packages
Language: English
Abstract:

One of the main aims in electronic packaging is a good heat transport away from the device, downwards through the package into the board. The LED chip is connected electrically at its top and bottom. That is why there is a need to separate the electric circuit from the metal board. This is achieved by an insulator layer, which is neither electrically nor thermally very conductive. In this study the thermal behavior of new dielectric materials in LED packages are investigated. Furthermore the influence of geometric parameters of the electrical layout has been tested by measurements and simulations.

Journal or Publication Title: Engineering Edge
Volume: 4
Number: 2
Divisions: 18 Department of Electrical Engineering and Information Technology > Institute for Electromechanical Design > Light Technology
18 Department of Electrical Engineering and Information Technology > Institute for Electromechanical Design
18 Department of Electrical Engineering and Information Technology
Date Deposited: 03 May 2016 16:36
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