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Maesurement of the mechanical stability of semiconductor line structures in drying liquids with application to pattern collapse

Peter, D. ; Dalmer, M. ; Lechner, A. ; Gigler, A. M. ; Stark, R. W. ; Bensch, W. (2011)
Maesurement of the mechanical stability of semiconductor line structures in drying liquids with application to pattern collapse.
In: J. Micromech. Microeng., 21
Article, Bibliographie

Item Type: Article
Erschienen: 2011
Creators: Peter, D. ; Dalmer, M. ; Lechner, A. ; Gigler, A. M. ; Stark, R. W. ; Bensch, W.
Type of entry: Bibliographie
Title: Maesurement of the mechanical stability of semiconductor line structures in drying liquids with application to pattern collapse
Language: English
Date: 2011
Journal or Publication Title: J. Micromech. Microeng.
Volume of the journal: 21
Divisions: Exzellenzinitiative
Exzellenzinitiative > Clusters of Excellence
Zentrale Einrichtungen
Exzellenzinitiative > Clusters of Excellence > Center of Smart Interfaces (CSI)
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Date Deposited: 12 Jan 2011 12:34
Last Modified: 03 Jun 2018 21:24
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