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Oxide thickness-dependent resistive switching characteristics of Cu/HfO2/Pt ECM devices

Kim, Taewook ; Vogel, Tobias ; Piros, Eszter ; Nasiou, Déspina ; Kaiser, Nico ; Schreyer, Philipp ; Winkler, Robert ; Zintler, Alexander ; Arzumanov, Alexey ; Petzold, Stefan ; Molina-Luna, Leopoldo ; Alff, Lambert (2023)
Oxide thickness-dependent resistive switching characteristics of Cu/HfO2/Pt ECM devices.
In: Applied Physics Letters, 2023 (122)
doi: 10.1063/5.0124781
Artikel, Bibliographie

Kurzbeschreibung (Abstract)

HfO2-based resistive random-access memory devices are promising candidates for new memory and computing applications. Hereby, scaling of the devices is a key issue, where overall fundamental switching and conduction mechanisms can be easily influenced by changes in the oxide layer thickness. This work addresses the oxide thickness-dependent resistive switching characteristics in Cu/HfO2/Pt memory devices through bipolar DC switching characterization. Forming, reset, and set characteristics are investigated depending on the oxide layer thickness, revealing a significant difference for thicker compared to thinner films. Thicker samples tend to show a more abrupt reset behavior and a larger set voltage variance, while for thinner samples, a more gradual reset behavior and a low set variance is found. These phenomena can be explained by a model based on thermally assisted electrochemical metallization. Furthermore, to understand the conduction mechanism of the devices, current–voltage curves of the set process were investigated. The devices are found to have an Ohmic conduction mechanism in the lower voltage region generally, while thinner samples tend to show an additional space-charge-limited current conduction mechanism in a higher voltage region.

Typ des Eintrags: Artikel
Erschienen: 2023
Autor(en): Kim, Taewook ; Vogel, Tobias ; Piros, Eszter ; Nasiou, Déspina ; Kaiser, Nico ; Schreyer, Philipp ; Winkler, Robert ; Zintler, Alexander ; Arzumanov, Alexey ; Petzold, Stefan ; Molina-Luna, Leopoldo ; Alff, Lambert
Art des Eintrags: Bibliographie
Titel: Oxide thickness-dependent resistive switching characteristics of Cu/HfO2/Pt ECM devices
Sprache: Englisch
Publikationsjahr: 9 Januar 2023
Verlag: AIP Publishing
Titel der Zeitschrift, Zeitung oder Schriftenreihe: Applied Physics Letters
Jahrgang/Volume einer Zeitschrift: 2023
(Heft-)Nummer: 122
Kollation: 6 Seiten
DOI: 10.1063/5.0124781
Kurzbeschreibung (Abstract):

HfO2-based resistive random-access memory devices are promising candidates for new memory and computing applications. Hereby, scaling of the devices is a key issue, where overall fundamental switching and conduction mechanisms can be easily influenced by changes in the oxide layer thickness. This work addresses the oxide thickness-dependent resistive switching characteristics in Cu/HfO2/Pt memory devices through bipolar DC switching characterization. Forming, reset, and set characteristics are investigated depending on the oxide layer thickness, revealing a significant difference for thicker compared to thinner films. Thicker samples tend to show a more abrupt reset behavior and a larger set voltage variance, while for thinner samples, a more gradual reset behavior and a low set variance is found. These phenomena can be explained by a model based on thermally assisted electrochemical metallization. Furthermore, to understand the conduction mechanism of the devices, current–voltage curves of the set process were investigated. The devices are found to have an Ohmic conduction mechanism in the lower voltage region generally, while thinner samples tend to show an additional space-charge-limited current conduction mechanism in a higher voltage region.

Zusätzliche Informationen:

Artikel-ID: 023502

Fachbereich(e)/-gebiet(e): 11 Fachbereich Material- und Geowissenschaften
11 Fachbereich Material- und Geowissenschaften > Materialwissenschaft
11 Fachbereich Material- und Geowissenschaften > Materialwissenschaft > Fachgebiet Elektronenmikroskopie
11 Fachbereich Material- und Geowissenschaften > Materialwissenschaft > Fachgebiet Dünne Schichten
Hinterlegungsdatum: 13 Jan 2023 10:52
Letzte Änderung: 13 Jan 2023 10:52
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