TU Darmstadt / ULB / TUbiblio

Application of transmission line pulsed (TLP) stress for thermal and reliability characterisation of compound semiconductor devices

Brandt, Michael ; Krozer, V. ; Schüßler, M. ; Lin, C. ; Simon, A. ; Vogt, A. ; Rodriguez-Girones Arboli, Manuel ; Parmeggiani, E. ; Grajal, J. (1998)
Application of transmission line pulsed (TLP) stress for thermal and reliability characterisation of compound semiconductor devices.
Reliability Center of Japan (RCJ) Symposium. Tokyo (1998)
Conference or Workshop Item, Bibliographie

Item Type: Conference or Workshop Item
Erschienen: 1998
Creators: Brandt, Michael ; Krozer, V. ; Schüßler, M. ; Lin, C. ; Simon, A. ; Vogt, A. ; Rodriguez-Girones Arboli, Manuel ; Parmeggiani, E. ; Grajal, J.
Type of entry: Bibliographie
Title: Application of transmission line pulsed (TLP) stress for thermal and reliability characterisation of compound semiconductor devices
Language: English
Date: 1998
Place of Publication: Tokyo
Book Title: Reliability Center of Japan (RCJ) Symposium <1998, Tokyo>: Proceedings
Event Title: Reliability Center of Japan (RCJ) Symposium
Event Location: Tokyo
Event Dates: 1998
Divisions: 18 Department of Electrical Engineering and Information Technology
Date Deposited: 19 Nov 2008 16:20
Last Modified: 19 Mar 2024 11:49
PPN:
Export:
Suche nach Titel in: TUfind oder in Google
Send an inquiry Send an inquiry

Options (only for editors)
Show editorial Details Show editorial Details