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Application of transmission line pulsed (TLP) stress for thermal and reliability characterisation of compound semiconductor devices

Brandt, Michael ; Krozer, ; Schüßler, ; Lin, ; Simon, ; Vogt, ; Rodriguez, ; Parmeggiani, ; Grajal, (1998):
Application of transmission line pulsed (TLP) stress for thermal and reliability characterisation of compound semiconductor devices.
In: Reliability Center of Japan (RCJ) Symposium <1998, Tokyo>: Proceedings, [Conference or Workshop Item]

Item Type: Conference or Workshop Item
Erschienen: 1998
Creators: Brandt, Michael ; Krozer, ; Schüßler, ; Lin, ; Simon, ; Vogt, ; Rodriguez, ; Parmeggiani, ; Grajal,
Title: Application of transmission line pulsed (TLP) stress for thermal and reliability characterisation of compound semiconductor devices
Language: English
Series: Reliability Center of Japan (RCJ) Symposium <1998, Tokyo>: Proceedings
Divisions: 18 Department of Electrical Engineering and Information Technology
Date Deposited: 19 Nov 2008 16:20
License: [undefiniert]
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