Brandt, Michael ; Krozer, ; Schüßler, ; Lin, ; Simon, ; Vogt, ; Rodriguez, ; Parmeggiani, ; Grajal, (1998):
Application of transmission line pulsed (TLP) stress for thermal and reliability characterisation of compound semiconductor devices.
In: Reliability Center of Japan (RCJ) Symposium <1998, Tokyo>: Proceedings, [Conference or Workshop Item]
| Item Type: | Conference or Workshop Item |
|---|---|
| Erschienen: | 1998 |
| Creators: | Brandt, Michael ; Krozer, ; Schüßler, ; Lin, ; Simon, ; Vogt, ; Rodriguez, ; Parmeggiani, ; Grajal, |
| Title: | Application of transmission line pulsed (TLP) stress for thermal and reliability characterisation of compound semiconductor devices |
| Language: | English |
| Series: | Reliability Center of Japan (RCJ) Symposium <1998, Tokyo>: Proceedings |
| Divisions: | 18 Department of Electrical Engineering and Information Technology |
| Date Deposited: | 19 Nov 2008 16:20 |
| License: | [undefiniert] |
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