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Blum, W. and Li, Y. J. and Durst, Karsten (2009):
Stability of ultrafine-grained Cu to subgrain coarsening and recrystallization in annealing and deformation at elevated temperatures.
In: Acta Materialia, pp. 5207-5217, 57, (17), ISSN 1359-6454,
DOI: 10.1016/j.actamat.2009.07.030,
[Article]

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