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Stability of ultrafine-grained Cu to subgrain coarsening and recrystallization in annealing and deformation at elevated temperatures

Blum, W. and Li, Y. J. and Durst, Karsten (2009):
Stability of ultrafine-grained Cu to subgrain coarsening and recrystallization in annealing and deformation at elevated temperatures.
In: Acta Materialia, pp. 5207-5217, 57, (17), ISSN 1359-6454,
DOI: 10.1016/j.actamat.2009.07.030,
[Article]

Item Type: Article
Erschienen: 2009
Creators: Blum, W. and Li, Y. J. and Durst, Karsten
Title: Stability of ultrafine-grained Cu to subgrain coarsening and recrystallization in annealing and deformation at elevated temperatures
Language: English
Journal or Publication Title: Acta Materialia
Volume: 57
Number: 17
Divisions: 11 Department of Materials and Earth Sciences
11 Department of Materials and Earth Sciences > Material Science
11 Department of Materials and Earth Sciences > Material Science > Physical Metallurgy
Date Deposited: 19 Jul 2018 14:23
DOI: 10.1016/j.actamat.2009.07.030
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