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Maesurement of the mechanical stability of semiconductor line structures in drying liquids with application to pattern collapse

Peter, D. and Dalmer, M. and Lechner, A. and Gigler, A. M. and Stark, R. W. and Bensch, W. (2011):
Maesurement of the mechanical stability of semiconductor line structures in drying liquids with application to pattern collapse.
21, In: J. Micromech. Microeng., pp. 025001, [Article]

Item Type: Article
Erschienen: 2011
Creators: Peter, D. and Dalmer, M. and Lechner, A. and Gigler, A. M. and Stark, R. W. and Bensch, W.
Title: Maesurement of the mechanical stability of semiconductor line structures in drying liquids with application to pattern collapse
Language: English
Journal or Publication Title: J. Micromech. Microeng.
Volume: 21
Divisions: Exzellenzinitiative
Exzellenzinitiative > Clusters of Excellence
Zentrale Einrichtungen
Exzellenzinitiative > Clusters of Excellence > Center of Smart Interfaces (CSI)
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Date Deposited: 12 Jan 2011 12:34
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