Kim, Taewook ; Vogel, Tobias ; Piros, Eszter ; Nasiou, Déspina ; Kaiser, Nico ; Schreyer, Philipp ; Winkler, Robert ; Zintler, Alexander ; Arzumanov, Alexey ; Petzold, Stefan ; Molina-Luna, Leopoldo ; Alff, Lambert (2023)
Oxide thickness-dependent resistive switching characteristics of Cu/HfO2/Pt ECM devices.
In: Applied Physics Letters, 2023 (122)
doi: 10.1063/5.0124781
Artikel, Bibliographie
Kurzbeschreibung (Abstract)
HfO2-based resistive random-access memory devices are promising candidates for new memory and computing applications. Hereby, scaling of the devices is a key issue, where overall fundamental switching and conduction mechanisms can be easily influenced by changes in the oxide layer thickness. This work addresses the oxide thickness-dependent resistive switching characteristics in Cu/HfO2/Pt memory devices through bipolar DC switching characterization. Forming, reset, and set characteristics are investigated depending on the oxide layer thickness, revealing a significant difference for thicker compared to thinner films. Thicker samples tend to show a more abrupt reset behavior and a larger set voltage variance, while for thinner samples, a more gradual reset behavior and a low set variance is found. These phenomena can be explained by a model based on thermally assisted electrochemical metallization. Furthermore, to understand the conduction mechanism of the devices, current–voltage curves of the set process were investigated. The devices are found to have an Ohmic conduction mechanism in the lower voltage region generally, while thinner samples tend to show an additional space-charge-limited current conduction mechanism in a higher voltage region.
Typ des Eintrags: | Artikel |
---|---|
Erschienen: | 2023 |
Autor(en): | Kim, Taewook ; Vogel, Tobias ; Piros, Eszter ; Nasiou, Déspina ; Kaiser, Nico ; Schreyer, Philipp ; Winkler, Robert ; Zintler, Alexander ; Arzumanov, Alexey ; Petzold, Stefan ; Molina-Luna, Leopoldo ; Alff, Lambert |
Art des Eintrags: | Bibliographie |
Titel: | Oxide thickness-dependent resistive switching characteristics of Cu/HfO2/Pt ECM devices |
Sprache: | Englisch |
Publikationsjahr: | 9 Januar 2023 |
Verlag: | AIP Publishing |
Titel der Zeitschrift, Zeitung oder Schriftenreihe: | Applied Physics Letters |
Jahrgang/Volume einer Zeitschrift: | 2023 |
(Heft-)Nummer: | 122 |
Kollation: | 6 Seiten |
DOI: | 10.1063/5.0124781 |
Kurzbeschreibung (Abstract): | HfO2-based resistive random-access memory devices are promising candidates for new memory and computing applications. Hereby, scaling of the devices is a key issue, where overall fundamental switching and conduction mechanisms can be easily influenced by changes in the oxide layer thickness. This work addresses the oxide thickness-dependent resistive switching characteristics in Cu/HfO2/Pt memory devices through bipolar DC switching characterization. Forming, reset, and set characteristics are investigated depending on the oxide layer thickness, revealing a significant difference for thicker compared to thinner films. Thicker samples tend to show a more abrupt reset behavior and a larger set voltage variance, while for thinner samples, a more gradual reset behavior and a low set variance is found. These phenomena can be explained by a model based on thermally assisted electrochemical metallization. Furthermore, to understand the conduction mechanism of the devices, current–voltage curves of the set process were investigated. The devices are found to have an Ohmic conduction mechanism in the lower voltage region generally, while thinner samples tend to show an additional space-charge-limited current conduction mechanism in a higher voltage region. |
Zusätzliche Informationen: | Artikel-ID: 023502 |
Fachbereich(e)/-gebiet(e): | 11 Fachbereich Material- und Geowissenschaften 11 Fachbereich Material- und Geowissenschaften > Materialwissenschaft 11 Fachbereich Material- und Geowissenschaften > Materialwissenschaft > Fachgebiet Elektronenmikroskopie 11 Fachbereich Material- und Geowissenschaften > Materialwissenschaft > Fachgebiet Dünne Schichten |
Hinterlegungsdatum: | 13 Jan 2023 10:52 |
Letzte Änderung: | 13 Jan 2023 10:52 |
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