Englisch

Rao, B. S. ; Hemambar, C. ; Pathak, A. V. ; Patel, K. J. ; Rödel, Jürgen ; Jayaram, V. (2006)
Al/SiC carriers for microwave integrated circuits by a new technique of pressureless infiltration.
In: IEEE transactions on electronics packaging manufacturing, 29
Artikel, Bibliographie