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Al/SiC carriers for microwave integrated circuits by a new technique of pressureless infiltration

Rao, B. S. and Hemambar, C. and Pathak, A. V. and Patel, K. J. and Rödel, Jürgen and Jayaram, V. (2006):
Al/SiC carriers for microwave integrated circuits by a new technique of pressureless infiltration.
In: IEEE transactions on electronics packaging manufacturing, pp. 58-63, 29, [Article]

Item Type: Article
Erschienen: 2006
Creators: Rao, B. S. and Hemambar, C. and Pathak, A. V. and Patel, K. J. and Rödel, Jürgen and Jayaram, V.
Title: Al/SiC carriers for microwave integrated circuits by a new technique of pressureless infiltration
Language: English
Journal or Publication Title: IEEE transactions on electronics packaging manufacturing
Volume: 29
Divisions: 11 Department of Materials and Earth Sciences
11 Department of Materials and Earth Sciences > Material Science > Nonmetallic-Inorganic Materials
11 Department of Materials and Earth Sciences > Material Science
Date Deposited: 20 Nov 2008 08:24
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