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Rao, B. S. and Hemambar, C. and Pathak, A. V. and Patel, K. J. and Rödel, Jürgen and Jayaram, V. (2006):
Al/SiC carriers for microwave integrated circuits by a new technique of pressureless infiltration.
In: IEEE transactions on electronics packaging manufacturing, pp. 58-63, 29, [Article]

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