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Guo, Y. and Becker, Wilfried and Fu, Y. and Zhang, W. :
Package Cushioning Properties of Corrugated Paperboard Pads with Hollow Pillars.
The Second International Conference on Packaging Technology and Science, 16.-18.10.2014, Wuxi, Book of Abstracts, Beitrag YB002.
[Conference or Workshop Item] , (2014)

This list was generated on Sat May 25 01:25:50 2019 CEST.