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Guo, Y. and Becker, Wilfried and Fu, Y. and Zhang, W. (2014):
Package Cushioning Properties of Corrugated Paperboard Pads with Hollow Pillars.
In: The Second International Conference on Packaging Technology and Science, 16.-18.10.2014, Wuxi, Book of Abstracts, Beitrag YB002., [Conference or Workshop Item]

This list was generated on Tue Oct 22 00:56:31 2019 CEST.