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Package Cushioning Properties of Corrugated Paperboard Pads with Hollow Pillars.

Guo, Y. and Becker, Wilfried and Fu, Y. and Zhang, W. :
Package Cushioning Properties of Corrugated Paperboard Pads with Hollow Pillars.
The Second International Conference on Packaging Technology and Science, 16.-18.10.2014, Wuxi, Book of Abstracts, Beitrag YB002.
[Conference or Workshop Item] , (2014)

Item Type: Conference or Workshop Item
Erschienen: 2014
Creators: Guo, Y. and Becker, Wilfried and Fu, Y. and Zhang, W.
Title: Package Cushioning Properties of Corrugated Paperboard Pads with Hollow Pillars.
Language: English
Title of Book: The Second International Conference on Packaging Technology and Science, 16.-18.10.2014, Wuxi, Book of Abstracts, Beitrag YB002.
Divisions: 16 Department of Mechanical Engineering > Institute of Structural Mechanics (FSM)
16 Department of Mechanical Engineering
Date Deposited: 03 Mar 2015 15:29
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