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Peter, Daniel and Dalmer, Michael and Lechner, Alfred and Gigler, Alexander M. and Stark, Robert W. and Bensch, Wolfgang (2011):
Measurement of the mechanical stability of semiconductor line structures in drying liquids with application to pattern collapse.
In: Journal of Micromechanics and Microengineering, 21 (2), ISSN 0960-1317,
[Online-Edition: http://dx.doi.org/10.1088/0960-1317/21/2/025001],
[Article]
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