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Measurement of the mechanical stability of semiconductor line structures in drying liquids with application to pattern collapse

Peter, Daniel and Dalmer, Michael and Lechner, Alfred and Gigler, Alexander M. and Stark, Robert W. and Bensch, Wolfgang (2011):
Measurement of the mechanical stability of semiconductor line structures in drying liquids with application to pattern collapse.
In: Journal of Micromechanics and Microengineering, 21, (2), ISSN 0960-1317,
[Online-Edition: http://dx.doi.org/10.1088/0960-1317/21/2/025001],
[Article]

Item Type: Article
Erschienen: 2011
Creators: Peter, Daniel and Dalmer, Michael and Lechner, Alfred and Gigler, Alexander M. and Stark, Robert W. and Bensch, Wolfgang
Title: Measurement of the mechanical stability of semiconductor line structures in drying liquids with application to pattern collapse
Language: German
Journal or Publication Title: Journal of Micromechanics and Microengineering
Volume: 21
Number: 2
Divisions: 11 Department of Materials and Earth Sciences
11 Department of Materials and Earth Sciences > Material Science
11 Department of Materials and Earth Sciences > Material Science > Physics of Surfaces
DFG-Collaborative Research Centres (incl. Transregio)
DFG-Collaborative Research Centres (incl. Transregio) > Collaborative Research Centres
Exzellenzinitiative
Exzellenzinitiative > Clusters of Excellence
Zentrale Einrichtungen
Exzellenzinitiative > Clusters of Excellence > Center of Smart Interfaces (CSI)
Date Deposited: 20 Jul 2016 12:33
Official URL: http://dx.doi.org/10.1088/0960-1317/21/2/025001
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