Martínez-Crespiera, S. ; Ionescu, E. ; Schlosser, M. ; Flittner, K. ; Mistura, G. ; Riedel, R. ; Schlaak, H. F. (2011)
Fabrication of silicon oxycarbide-based microcomponents via photolithographic and soft lithography approaches.
In: Sensors and Actuators A: Physical, 169 (1)
doi: 10.1016/j.sna.2011.04.041
Artikel, Bibliographie
Kurzbeschreibung (Abstract)
This work presents the fabrication of SiOC ceramic microparts starting from a commercially available preceramic polysiloxane. Two different micro structuring techniques were applied, e.g. photolithography and soft-lithography. For both processes, photo-crosslinking of the preceramic polymer was performed. Subsequently, the green microparts were pyrolysed under argon at temperatures between 1000 and 1400 °C to yield ceramic SiOC microcomponents. In this way, ceramic microstructures on Si wafers (with dimensions down to 20 μm) have been obtained by photolithographic techniques; free-standing and complex shaped ceramic microcomponents (aspect ratios up to 3:1) were also produced using soft lithography techniques, i.e. replica molding (RM) followed by micro transfer molding (μTM).
| Typ des Eintrags: | Artikel |
|---|---|
| Erschienen: | 2011 |
| Autor(en): | Martínez-Crespiera, S. ; Ionescu, E. ; Schlosser, M. ; Flittner, K. ; Mistura, G. ; Riedel, R. ; Schlaak, H. F. |
| Art des Eintrags: | Bibliographie |
| Titel: | Fabrication of silicon oxycarbide-based microcomponents via photolithographic and soft lithography approaches |
| Sprache: | Englisch |
| Publikationsjahr: | 10 September 2011 |
| Verlag: | Elsevier |
| Titel der Zeitschrift, Zeitung oder Schriftenreihe: | Sensors and Actuators A: Physical |
| Jahrgang/Volume einer Zeitschrift: | 169 |
| (Heft-)Nummer: | 1 |
| DOI: | 10.1016/j.sna.2011.04.041 |
| Kurzbeschreibung (Abstract): | This work presents the fabrication of SiOC ceramic microparts starting from a commercially available preceramic polysiloxane. Two different micro structuring techniques were applied, e.g. photolithography and soft-lithography. For both processes, photo-crosslinking of the preceramic polymer was performed. Subsequently, the green microparts were pyrolysed under argon at temperatures between 1000 and 1400 °C to yield ceramic SiOC microcomponents. In this way, ceramic microstructures on Si wafers (with dimensions down to 20 μm) have been obtained by photolithographic techniques; free-standing and complex shaped ceramic microcomponents (aspect ratios up to 3:1) were also produced using soft lithography techniques, i.e. replica molding (RM) followed by micro transfer molding (μTM). |
| Freie Schlagworte: | Polymer derived ceramics, Photolithography, Soft-lithography, SiOC, Microcomponents |
| Fachbereich(e)/-gebiet(e): | 11 Fachbereich Material- und Geowissenschaften > Materialwissenschaft > Fachgebiet Disperse Feststoffe 11 Fachbereich Material- und Geowissenschaften > Materialwissenschaft 11 Fachbereich Material- und Geowissenschaften |
| Hinterlegungsdatum: | 04 Apr 2012 09:13 |
| Letzte Änderung: | 05 Mär 2013 10:00 |
| PPN: | |
| Sponsoren: | European Community FP6 (MCRTN-019601, PolyCerNet), Bundesministerium für Bildung und Forschung, Berlin, Germany (BMBF, Grant No. 16SV3724), The authors acknowledge also the company Starfire Systems Inc., USA, for providing Polyramic® RD-684a. |
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