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Piezoelectret Sensors from Direct 3D-Printing onto Bulk Films

Sellami, Youssef ; Ben Dali, Omar ; Chadda, Romol ; Zhukov, Sergey ; Guermazi, Mahdi ; Altmann, Alexander A. ; Seggern, Heinz von ; Latsch, Bastian ; Schäfer, Niklas ; Kupnik, Mario (2023)
Piezoelectret Sensors from Direct 3D-Printing onto Bulk Films.
IEEE SENSORS 2023. Vienna, Austria (29.10.-01.11.2023)
doi: 10.1109/SENSORS56945.2023.10324862
Konferenzveröffentlichung, Bibliographie

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Kurzbeschreibung (Abstract)

The development of piezoelectric sensors using ferroelectrets is a very active field that is increasingly gaining importance. Recently, 3D-printing ferroelectret sensors using fused deposition modeling technique has been extensively investigated due to its unparalleled advantages in terms of design flexibility and cost-effectiveness. Nevertheless, printed structures are more rigid than bulk materials due to the minimal printable thicknesses. In this work, we present a new method that combines the advantages of 3D-printing with the high performance of bulk materials by bonding both layers in the printing process. Hereby, a polylactic acid (PLA) filament is directly printed on a 20 μm-thick bulk PLA film to form well-defined structures. This structure is thermally bonded with another PLA bulk film to form the ferroelectret. In order to enhance the sensitivity of the ferroelectrets, an additional elastomeric layer is utilized. By varying the material and thickness of the elastomeric cover, piezoelectric d₃₃-coefficients of 713 pC N ⁻¹ and 229 pC N ⁻¹ are achieved using Ecoflex™ and foamed thermoplastic polyurethane (TPU), respectively. Increasing the thickness of the Ecoflex™ cover shows a significant increase of 259 % of the piezoelectric d₃₃-coefficient.

Typ des Eintrags: Konferenzveröffentlichung
Erschienen: 2023
Autor(en): Sellami, Youssef ; Ben Dali, Omar ; Chadda, Romol ; Zhukov, Sergey ; Guermazi, Mahdi ; Altmann, Alexander A. ; Seggern, Heinz von ; Latsch, Bastian ; Schäfer, Niklas ; Kupnik, Mario
Art des Eintrags: Bibliographie
Titel: Piezoelectret Sensors from Direct 3D-Printing onto Bulk Films
Sprache: Englisch
Publikationsjahr: 2023
Ort: Piscataway, NJ
Verlag: IEEE
Buchtitel: 2023 IEEE SENSORS Proceedings
Kollation: 4 Seiten
Veranstaltungstitel: IEEE SENSORS 2023
Veranstaltungsort: Vienna, Austria
Veranstaltungsdatum: 29.10.-01.11.2023
DOI: 10.1109/SENSORS56945.2023.10324862
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Kurzbeschreibung (Abstract):

The development of piezoelectric sensors using ferroelectrets is a very active field that is increasingly gaining importance. Recently, 3D-printing ferroelectret sensors using fused deposition modeling technique has been extensively investigated due to its unparalleled advantages in terms of design flexibility and cost-effectiveness. Nevertheless, printed structures are more rigid than bulk materials due to the minimal printable thicknesses. In this work, we present a new method that combines the advantages of 3D-printing with the high performance of bulk materials by bonding both layers in the printing process. Hereby, a polylactic acid (PLA) filament is directly printed on a 20 μm-thick bulk PLA film to form well-defined structures. This structure is thermally bonded with another PLA bulk film to form the ferroelectret. In order to enhance the sensitivity of the ferroelectrets, an additional elastomeric layer is utilized. By varying the material and thickness of the elastomeric cover, piezoelectric d₃₃-coefficients of 713 pC N ⁻¹ and 229 pC N ⁻¹ are achieved using Ecoflex™ and foamed thermoplastic polyurethane (TPU), respectively. Increasing the thickness of the Ecoflex™ cover shows a significant increase of 259 % of the piezoelectric d₃₃-coefficient.

Freie Schlagworte: Printing, Sensitivity, Programmable logic arrays, Sensor fusion, Sensors, Bonding, Ferroelectret, piezoelectret, piezoelectric sensors, 3D-printing, biodegradable
Sachgruppe der Dewey Dezimalklassifikatin (DDC): 600 Technik, Medizin, angewandte Wissenschaften > 621.3 Elektrotechnik, Elektronik
Fachbereich(e)/-gebiet(e): 18 Fachbereich Elektrotechnik und Informationstechnik
18 Fachbereich Elektrotechnik und Informationstechnik > Mess- und Sensortechnik
Hinterlegungsdatum: 13 Mai 2024 08:57
Letzte Änderung: 13 Mai 2024 08:57
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