Schmidt, Hendrik ; Käß, Markus ; Lichtinger, Roland ; Hülsebrock, Moritz (2024)
Concept for a simulation-based reilability assessment at the system level of printed circuit boards.
25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Catania (07.04.2024 - 10.04.2024)
doi: 10.1109/EuroSimE60745.2024.10491430
Konferenzveröffentlichung, Bibliographie

Käß, Markus ; Schmidt, Hendrik ; Hülsebrock, Moritz ; Lichtinger, Roland ; Bein, Thilo (2024)
Solder fatigue life modeling of QFN components based on design of experiments.
In: Microelectronics Reliability, 152
doi: 10.1016/j.microrel.2023.115297
Artikel, Bibliographie

Käß, Markus ; Schmidt, Hendrik ; Hülsebrock, Moritz ; Lichtinger, Roland (2022)
Effect of ambient temperature variation on solder joint reliability under harmonic vibration loading.
ISMA2022. Leuven (12.09.2022 - 14.09.2022)
Konferenzveröffentlichung, Bibliographie

Schmidt, Hendrik ; Käß, Markus ; Lichtinger, Roland ; Hülsebrock, Moritz (2022)
Hierarchical Bayesian model for simulating the mechanical behavior of bare printed circuit boards with fixing.
ECCOMAS Congress 2022 - 8th European Congress on Computational Methods in Applied Sciences and Engineering. Oslo (05.06.2022 - 09.06.2022)
doi: 10.23967/eccomas.2022.136
Konferenzveröffentlichung, Bibliographie

Käß, Markus ; Schmidt, Hendrik ; Lichtinger, Roland (2022)
In-situ method for fatigue life assessment subjected to surface strain.
23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). St. Julian, Malta (25.04.2022 - 27.04.2022)
doi: 10.1109/EuroSimE54907.2022.9758843
Konferenzveröffentlichung, Bibliographie