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Tightly adhering diamond-like carbon films on copper substrates by oxygen pre-implantation

Flege, S. and Hatada, R. and Vogel, T. and Bruder, E. and Major, M. and Ensinger, W. and Baba, K. :
Tightly adhering diamond-like carbon films on copper substrates by oxygen pre-implantation.
[Online-Edition: https://doi.org/10.1016/j.surfcoat.2017.12.029]
In: Surface and Coatings Technology ISSN 02578972
[Article] , (2017) (In Press)

Official URL: https://doi.org/10.1016/j.surfcoat.2017.12.029

Abstract

Copper is one of the substrates that are difficult to coat with a diamond-like carbon film because of the latter's poor adhesion. Two factors that can improve the adhesion in this case are the surface roughness and the oxidation of the surface. The dependence of the adhesive strength of the diamond-like carbon film on both factors was measured for samples that were prepared by a plasma process using a pulsed voltage. The main parameter was the ion energy of the oxygen ions. For pulse voltages higher than − 16 kV a drastically increased adhesion was found, correlated to a rough surface and the presence of Cu2O in the interface. The adhesive strength of the film surpasses the maximum amount that can be measured with a pull test. The same good adhesion can be realized at lower voltages by changing the plasma gas to a mixture of oxygen and argon. The additional argon changes the surface topography of a polycrystalline copper substrate.

Item Type: Article
Erschienen: 2017
Creators: Flege, S. and Hatada, R. and Vogel, T. and Bruder, E. and Major, M. and Ensinger, W. and Baba, K.
Title: Tightly adhering diamond-like carbon films on copper substrates by oxygen pre-implantation
Language: English
Abstract:

Copper is one of the substrates that are difficult to coat with a diamond-like carbon film because of the latter's poor adhesion. Two factors that can improve the adhesion in this case are the surface roughness and the oxidation of the surface. The dependence of the adhesive strength of the diamond-like carbon film on both factors was measured for samples that were prepared by a plasma process using a pulsed voltage. The main parameter was the ion energy of the oxygen ions. For pulse voltages higher than − 16 kV a drastically increased adhesion was found, correlated to a rough surface and the presence of Cu2O in the interface. The adhesive strength of the film surpasses the maximum amount that can be measured with a pull test. The same good adhesion can be realized at lower voltages by changing the plasma gas to a mixture of oxygen and argon. The additional argon changes the surface topography of a polycrystalline copper substrate.

Journal or Publication Title: Surface and Coatings Technology
Publisher: Elsevier Science Publishing
Uncontrolled Keywords: Diamond-like carbon, Oxidation, Implantation, Copper, Adhesion
Divisions: 11 Department of Materials and Earth Sciences
11 Department of Materials and Earth Sciences > Material Science
11 Department of Materials and Earth Sciences > Material Science > Advanced Thin Film Technology
11 Department of Materials and Earth Sciences > Material Science > Material Analytics
11 Department of Materials and Earth Sciences > Material Science > Physical Metallurgy
Date Deposited: 27 Dec 2017 09:00
DOI: 10.1016/j.surfcoat.2017.12.029
Official URL: https://doi.org/10.1016/j.surfcoat.2017.12.029
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