Flege, S. ; Hatada, R. ; Vogel, T. ; Bruder, E. ; Major, M. ; Ensinger, W. ; Baba, K. (2017)
Tightly adhering diamond-like carbon films on copper substrates by oxygen pre-implantation.
In: Surface and Coatings Technology, 335
doi: 10.1016/j.surfcoat.2017.12.029
Artikel, Bibliographie
Kurzbeschreibung (Abstract)
Copper is one of the substrates that are difficult to coat with a diamond-like carbon film because of the latter's poor adhesion. Two factors that can improve the adhesion in this case are the surface roughness and the oxidation of the surface. The dependence of the adhesive strength of the diamond-like carbon film on both factors was measured for samples that were prepared by a plasma process using a pulsed voltage. The main parameter was the ion energy of the oxygen ions. For pulse voltages higher than − 16 kV a drastically increased adhesion was found, correlated to a rough surface and the presence of Cu2O in the interface. The adhesive strength of the film surpasses the maximum amount that can be measured with a pull test. The same good adhesion can be realized at lower voltages by changing the plasma gas to a mixture of oxygen and argon. The additional argon changes the surface topography of a polycrystalline copper substrate.
| Typ des Eintrags: | Artikel |
|---|---|
| Erschienen: | 2017 |
| Autor(en): | Flege, S. ; Hatada, R. ; Vogel, T. ; Bruder, E. ; Major, M. ; Ensinger, W. ; Baba, K. |
| Art des Eintrags: | Bibliographie |
| Titel: | Tightly adhering diamond-like carbon films on copper substrates by oxygen pre-implantation |
| Sprache: | Englisch |
| Publikationsjahr: | 2017 |
| Verlag: | Elsevier Science Publishing |
| Titel der Zeitschrift, Zeitung oder Schriftenreihe: | Surface and Coatings Technology |
| Jahrgang/Volume einer Zeitschrift: | 335 |
| DOI: | 10.1016/j.surfcoat.2017.12.029 |
| URL / URN: | https://doi.org/10.1016/j.surfcoat.2017.12.029 |
| Kurzbeschreibung (Abstract): | Copper is one of the substrates that are difficult to coat with a diamond-like carbon film because of the latter's poor adhesion. Two factors that can improve the adhesion in this case are the surface roughness and the oxidation of the surface. The dependence of the adhesive strength of the diamond-like carbon film on both factors was measured for samples that were prepared by a plasma process using a pulsed voltage. The main parameter was the ion energy of the oxygen ions. For pulse voltages higher than − 16 kV a drastically increased adhesion was found, correlated to a rough surface and the presence of Cu2O in the interface. The adhesive strength of the film surpasses the maximum amount that can be measured with a pull test. The same good adhesion can be realized at lower voltages by changing the plasma gas to a mixture of oxygen and argon. The additional argon changes the surface topography of a polycrystalline copper substrate. |
| Freie Schlagworte: | Diamond-like carbon, Oxidation, Implantation, Copper, Adhesion |
| Fachbereich(e)/-gebiet(e): | 11 Fachbereich Material- und Geowissenschaften 11 Fachbereich Material- und Geowissenschaften > Materialwissenschaft 11 Fachbereich Material- und Geowissenschaften > Materialwissenschaft > Fachgebiet Dünne Schichten 11 Fachbereich Material- und Geowissenschaften > Materialwissenschaft > Fachgebiet Materialanalytik 11 Fachbereich Material- und Geowissenschaften > Materialwissenschaft > Fachgebiet Physikalische Metallkunde |
| Hinterlegungsdatum: | 27 Dez 2017 09:00 |
| Letzte Änderung: | 17 Sep 2020 09:55 |
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