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Influence of sputter rate and crystal orientation on the distribution of carbon in polycrystalline copper surfaces treated by plasma immersion ion implantation

Flege, S. and Kraft, G. and Bruder, E. and Baba, K. and Hatada, R. and Ensinger, W. (2009):
Influence of sputter rate and crystal orientation on the distribution of carbon in polycrystalline copper surfaces treated by plasma immersion ion implantation.
In: Journal of Applied Physics 106, American Institute of Physics, pp. 023302, 106, (2), [Article]

Abstract

The sputter rate influences the resulting thickness of the carbon containing layer within a surface that was treated by plasma immersion ion implantation. Choosing a polycrystalline substrate with rather large crystals and a material with an inherent high sputter rate, inhomogeneous distributions of carbon over the substrate area due to different thicknesses of the incorporated carbon can be detected. A correlation of three factors namely the carbon x-ray intensity in electron probe microanalysis, the thickness of the carbon layer, and the sputter rate in depth profiling measurements via secondary ion mass spectrometry can be shown. Essential for these factors is the crystal orientation that is visualized by mapping via electron backscatter diffraction. The differences in carbon content due to the orientation are most likely one of the reasons that the adhesion of diamond-like carbon films on copper does not improve with an interlayer of implanted carbon.

Item Type: Article
Erschienen: 2009
Creators: Flege, S. and Kraft, G. and Bruder, E. and Baba, K. and Hatada, R. and Ensinger, W.
Title: Influence of sputter rate and crystal orientation on the distribution of carbon in polycrystalline copper surfaces treated by plasma immersion ion implantation
Language: English
Abstract:

The sputter rate influences the resulting thickness of the carbon containing layer within a surface that was treated by plasma immersion ion implantation. Choosing a polycrystalline substrate with rather large crystals and a material with an inherent high sputter rate, inhomogeneous distributions of carbon over the substrate area due to different thicknesses of the incorporated carbon can be detected. A correlation of three factors namely the carbon x-ray intensity in electron probe microanalysis, the thickness of the carbon layer, and the sputter rate in depth profiling measurements via secondary ion mass spectrometry can be shown. Essential for these factors is the crystal orientation that is visualized by mapping via electron backscatter diffraction. The differences in carbon content due to the orientation are most likely one of the reasons that the adhesion of diamond-like carbon films on copper does not improve with an interlayer of implanted carbon.

Journal or Publication Title: Journal of Applied Physics 106
Volume: 106
Number: 2
Publisher: American Institute of Physics
Uncontrolled Keywords: adhesion, carbon, copper, crystal orientation, electron backscattering, electron diffraction, electron probe analysis, grain boundaries, plasma immersion ion implantation, polishing, secondary ion mass spectra, sputter deposition, thin films
Divisions: 11 Department of Materials and Earth Sciences > Material Science > Material Analytics
11 Department of Materials and Earth Sciences > Material Science > Physical Metallurgy
DFG-Collaborative Research Centres (incl. Transregio) > Collaborative Research Centres > CRC 666: Integral Sheet Metal Design with Higher Order Bifurcations
11 Department of Materials and Earth Sciences > Material Science
11 Department of Materials and Earth Sciences
Zentrale Einrichtungen
DFG-Collaborative Research Centres (incl. Transregio) > Collaborative Research Centres
DFG-Collaborative Research Centres (incl. Transregio)
Date Deposited: 04 Apr 2011 13:40
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