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Operando two-terminal devices inside a transmission electron microscope

Recalde-Benitez, Oscar ; Jiang, Tianshu ; Winkler, Robert ; Ruan, Yating ; Zintler, Alexander ; Adabifiroozjaei, Esmaeil ; Arzumanov, Alexey ; Hubbard, William A. ; Omme, Tijn van ; Pivak, Yevheniy ; Perez-Garza, Hector H. ; Regan, B.C. ; Alff, Lambert ; Komissinskiy, Philipp ; Molina-Luna, Leopoldo (2023)
Operando two-terminal devices inside a transmission electron microscope.
In: Communications Engineering, 2
doi: 10.1038/s44172-023-00133-9
Artikel, Bibliographie

Kurzbeschreibung (Abstract)

Advanced nanomaterials are at the core of innovation for the microelectronics industry. Designing, characterizing, and testing two-terminal devices, such as metal-insulator-metal structures, is key to improving material stack design and integration. Electrical biasing within in situ transmission electron microscopy using MEMS-based platforms is a promising technique for nano-characterization under operando conditions. However, conventional focused ion beam sample preparation can introduce parasitic current paths, limiting device performance and leading to overestimated electrical responses. Here we demonstrate connectivity of TEM lamella devices obtained from a novel electrical contacting method based solely on van der Waals forces. This method reduces parasitic leakage currents by at least five orders of magnitude relative to reported preparation approaches. Our methodology enables operation of stack devices inside a microscope with device currents as low as 10 pA. We apply this approach to observe in situ biasing-induced defect formation, providing valuable insights into the behavior of an SrTiO3-based memristor.

Typ des Eintrags: Artikel
Erschienen: 2023
Autor(en): Recalde-Benitez, Oscar ; Jiang, Tianshu ; Winkler, Robert ; Ruan, Yating ; Zintler, Alexander ; Adabifiroozjaei, Esmaeil ; Arzumanov, Alexey ; Hubbard, William A. ; Omme, Tijn van ; Pivak, Yevheniy ; Perez-Garza, Hector H. ; Regan, B.C. ; Alff, Lambert ; Komissinskiy, Philipp ; Molina-Luna, Leopoldo
Art des Eintrags: Bibliographie
Titel: Operando two-terminal devices inside a transmission electron microscope
Sprache: Englisch
Publikationsjahr: 23 November 2023
Ort: London
Verlag: Springer Nature
Titel der Zeitschrift, Zeitung oder Schriftenreihe: Communications Engineering
Jahrgang/Volume einer Zeitschrift: 2
Kollation: 8 Seiten
DOI: 10.1038/s44172-023-00133-9
URL / URN: https://www.nature.com/articles/s44172-023-00133-9
Kurzbeschreibung (Abstract):

Advanced nanomaterials are at the core of innovation for the microelectronics industry. Designing, characterizing, and testing two-terminal devices, such as metal-insulator-metal structures, is key to improving material stack design and integration. Electrical biasing within in situ transmission electron microscopy using MEMS-based platforms is a promising technique for nano-characterization under operando conditions. However, conventional focused ion beam sample preparation can introduce parasitic current paths, limiting device performance and leading to overestimated electrical responses. Here we demonstrate connectivity of TEM lamella devices obtained from a novel electrical contacting method based solely on van der Waals forces. This method reduces parasitic leakage currents by at least five orders of magnitude relative to reported preparation approaches. Our methodology enables operation of stack devices inside a microscope with device currents as low as 10 pA. We apply this approach to observe in situ biasing-induced defect formation, providing valuable insights into the behavior of an SrTiO3-based memristor.

Zusätzliche Informationen:

Artikel-ID: 83

Fachbereich(e)/-gebiet(e): 11 Fachbereich Material- und Geowissenschaften
11 Fachbereich Material- und Geowissenschaften > Materialwissenschaft
11 Fachbereich Material- und Geowissenschaften > Materialwissenschaft > Fachgebiet Elektronenmikroskopie
11 Fachbereich Material- und Geowissenschaften > Materialwissenschaft > Fachgebiet Dünne Schichten
Hinterlegungsdatum: 26 Jan 2024 07:57
Letzte Änderung: 26 Jan 2024 08:06
PPN: 515063185
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