Hauf, Ulla ; Kauffmann, Alexander ; Kauffmann-Weiss, Sandra ; Feilbach, Alexander ; Boening, Mike ; Mueller, Frank E. H. ; Hinrichsen, Volker ; Heilmaier, Martin (2024)
Microstructure Formation and Resistivity Change in CuCr during Rapid Solidification.
In: Metals, 2017, 7 (11)
doi: 10.26083/tuprints-00016358
Artikel, Zweitveröffentlichung, Verlagsversion
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Kurzbeschreibung (Abstract)
The formation of the surface-near microstructure after a current interruption of CuCr contact materials in a vacuum interrupter is characterized by a fast heating and subsequently rapid solidification process. In the present article, we reveal and analyse the formation of two distinct microstructural regions that result from the heat, which is generated and dissipated during interruption. In the topmost region, local and global texture, as well as the resulting microstructure, indicate that both Cu and Cr were melted during rapid heating and solidification whereas in the region underneath, only Cu was melted and elongated Cu-grains solidified with the <001>-direction perpendicularly aligned to the surface. By analysing the lattice parameter of the Cu solid solution, a supersaturation of the solid solution with about 2.25 at % Cr was found independent if Cu was melted solely or together with the Cr. The according reduction of electrical conductivity in the topmost region subsequent to current interruption and the resulting heat distribution are discussed based on these experimental results.
| Typ des Eintrags: | Artikel |
|---|---|
| Erschienen: | 2024 |
| Autor(en): | Hauf, Ulla ; Kauffmann, Alexander ; Kauffmann-Weiss, Sandra ; Feilbach, Alexander ; Boening, Mike ; Mueller, Frank E. H. ; Hinrichsen, Volker ; Heilmaier, Martin |
| Art des Eintrags: | Zweitveröffentlichung |
| Titel: | Microstructure Formation and Resistivity Change in CuCr during Rapid Solidification |
| Sprache: | Englisch |
| Publikationsjahr: | 16 Januar 2024 |
| Ort: | Darmstadt |
| Publikationsdatum der Erstveröffentlichung: | 2017 |
| Ort der Erstveröffentlichung: | Basel |
| Verlag: | MDPI |
| Titel der Zeitschrift, Zeitung oder Schriftenreihe: | Metals |
| Jahrgang/Volume einer Zeitschrift: | 7 |
| (Heft-)Nummer: | 11 |
| Kollation: | 14 Seiten |
| DOI: | 10.26083/tuprints-00016358 |
| URL / URN: | https://tuprints.ulb.tu-darmstadt.de/16358 |
| Zugehörige Links: | |
| Herkunft: | Zweitveröffentlichung DeepGreen |
| Kurzbeschreibung (Abstract): | The formation of the surface-near microstructure after a current interruption of CuCr contact materials in a vacuum interrupter is characterized by a fast heating and subsequently rapid solidification process. In the present article, we reveal and analyse the formation of two distinct microstructural regions that result from the heat, which is generated and dissipated during interruption. In the topmost region, local and global texture, as well as the resulting microstructure, indicate that both Cu and Cr were melted during rapid heating and solidification whereas in the region underneath, only Cu was melted and elongated Cu-grains solidified with the <001>-direction perpendicularly aligned to the surface. By analysing the lattice parameter of the Cu solid solution, a supersaturation of the solid solution with about 2.25 at % Cr was found independent if Cu was melted solely or together with the Cr. The according reduction of electrical conductivity in the topmost region subsequent to current interruption and the resulting heat distribution are discussed based on these experimental results. |
| Freie Schlagworte: | CuCr, supersaturation, solid solution, texture, powder metallurgy, microstructure, contact material, vacuum interrupter, heat affected volume |
| Status: | Verlagsversion |
| URN: | urn:nbn:de:tuda-tuprints-163587 |
| Sachgruppe der Dewey Dezimalklassifikatin (DDC): | 500 Naturwissenschaften und Mathematik > 530 Physik 600 Technik, Medizin, angewandte Wissenschaften > 621.3 Elektrotechnik, Elektronik 600 Technik, Medizin, angewandte Wissenschaften > 660 Technische Chemie |
| Fachbereich(e)/-gebiet(e): | 18 Fachbereich Elektrotechnik und Informationstechnik 18 Fachbereich Elektrotechnik und Informationstechnik > Institut für Elektrische Energiesysteme > Hochspannungstechnik 18 Fachbereich Elektrotechnik und Informationstechnik > Institut für Elektrische Energiesysteme |
| Hinterlegungsdatum: | 16 Jan 2024 10:49 |
| Letzte Änderung: | 26 Feb 2024 16:22 |
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| Suche nach Titel in: | TUfind oder in Google |
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- Microstructure Formation and Resistivity Change in CuCr during Rapid Solidification. (deposited 16 Jan 2024 10:49) [Gegenwärtig angezeigt]
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