Hauf, Ulla ; Kauffmann, Alexander ; Kauffmann-Weiss, Sandra ; Feilbach, Alexander ; Boening, Mike ; Mueller, Frank E. H. ; Hinrichsen, Volker ; Heilmaier, Martin (2017)
Microstructure Formation and Resistivity Change in CuCr during Rapid Solidification.
In: Metals, 7 (11)
doi: 10.3390/met7110478
Artikel, Bibliographie
Dies ist die neueste Version dieses Eintrags.
Kurzbeschreibung (Abstract)
The formation of the surface-near microstructure after a current interruption of CuCr contact materials in a vacuum interrupter is characterized by a fast heating and subsequently rapid solidification process. In the present article, we reveal and analyse the formation of two distinct microstructural regions that result from the heat, which is generated and dissipated during interruption. In the topmost region, local and global texture, as well as the resulting microstructure, indicate that both Cu and Cr were melted during rapid heating and solidification whereas in the region underneath, only Cu was melted and elongated Cu-grains solidified with the <001>-direction perpendicularly aligned to the surface. By analysing the lattice parameter of the Cu solid solution, a supersaturation of the solid solution with about 2.25 at % Cr was found independent if Cu was melted solely or together with the Cr. The according reduction of electrical conductivity in the topmost region subsequent to current interruption and the resulting heat distribution are discussed based on these experimental results.
| Typ des Eintrags: | Artikel |
|---|---|
| Erschienen: | 2017 |
| Autor(en): | Hauf, Ulla ; Kauffmann, Alexander ; Kauffmann-Weiss, Sandra ; Feilbach, Alexander ; Boening, Mike ; Mueller, Frank E. H. ; Hinrichsen, Volker ; Heilmaier, Martin |
| Art des Eintrags: | Bibliographie |
| Titel: | Microstructure Formation and Resistivity Change in CuCr during Rapid Solidification |
| Sprache: | Englisch |
| Publikationsjahr: | 4 November 2017 |
| Ort: | Basel |
| Verlag: | MDPI |
| Titel der Zeitschrift, Zeitung oder Schriftenreihe: | Metals |
| Jahrgang/Volume einer Zeitschrift: | 7 |
| (Heft-)Nummer: | 11 |
| Kollation: | 14 Seiten |
| DOI: | 10.3390/met7110478 |
| Zugehörige Links: | |
| Kurzbeschreibung (Abstract): | The formation of the surface-near microstructure after a current interruption of CuCr contact materials in a vacuum interrupter is characterized by a fast heating and subsequently rapid solidification process. In the present article, we reveal and analyse the formation of two distinct microstructural regions that result from the heat, which is generated and dissipated during interruption. In the topmost region, local and global texture, as well as the resulting microstructure, indicate that both Cu and Cr were melted during rapid heating and solidification whereas in the region underneath, only Cu was melted and elongated Cu-grains solidified with the <001>-direction perpendicularly aligned to the surface. By analysing the lattice parameter of the Cu solid solution, a supersaturation of the solid solution with about 2.25 at % Cr was found independent if Cu was melted solely or together with the Cr. The according reduction of electrical conductivity in the topmost region subsequent to current interruption and the resulting heat distribution are discussed based on these experimental results. |
| Freie Schlagworte: | CuCr, supersaturation, solid solution, texture, powder metallurgy, microstructure, contact material, vacuum interrupter, heat affected volume |
| Zusätzliche Informationen: | Erstveröffentlichung |
| Sachgruppe der Dewey Dezimalklassifikatin (DDC): | 500 Naturwissenschaften und Mathematik > 530 Physik 600 Technik, Medizin, angewandte Wissenschaften > 621.3 Elektrotechnik, Elektronik 600 Technik, Medizin, angewandte Wissenschaften > 660 Technische Chemie |
| Fachbereich(e)/-gebiet(e): | 18 Fachbereich Elektrotechnik und Informationstechnik 18 Fachbereich Elektrotechnik und Informationstechnik > Institut für Elektrische Energiesysteme > Hochspannungstechnik 18 Fachbereich Elektrotechnik und Informationstechnik > Institut für Elektrische Energiesysteme |
| Hinterlegungsdatum: | 28 Feb 2024 07:22 |
| Letzte Änderung: | 28 Feb 2024 07:22 |
| PPN: | |
| Zugehörige Links: | |
| Export: | |
| Suche nach Titel in: | TUfind oder in Google |
Verfügbare Versionen dieses Eintrags
-
Microstructure Formation and Resistivity Change in CuCr during Rapid Solidification. (deposited 16 Jan 2024 10:49)
- Microstructure Formation and Resistivity Change in CuCr during Rapid Solidification. (deposited 28 Feb 2024 07:22) [Gegenwärtig angezeigt]
 |
Frage zum Eintrag |
Optionen (nur für Redakteure)
 |
Redaktionelle Details anzeigen |
Drucken
Impressum