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Number of items: 9.

Dineva, P. ; Gross, D. ; Müller, R. ; Rangelov, T. (2011):
Dynamic stress and electric field concentration in a functionally graded piezoelectric solid with a circular hole.
In: ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik, 91 (2), pp. 110-124. ISSN 1521-4001,
DOI: 10.1002/zamm.201000140,
[Article]

Dineva, P. ; Rangelov, T. ; Gross, Dietmar (2005):
BIEM for 2D steady-state problems in cracked anisotropic materials.
In: Engineering Analysis with Boundary Elements, 29 (7), pp. 689-698. ISSN 09557997,
[Article]

Gross, Dietmar ; Rangelov, T. ; Dineva, P. (2005):
2DWave Scattering by a Crack in a Piezoelectric Plane Using Traction BIEM.
In: SID, 1 (1), pp. 35-47. Tech science Press, ISSN 1551-3750,
[Article]

Gross, Dietmar ; Dineva, P. ; Rangelov, T. (2004):
BIEM for cracked piezoelectric solids under dynamic load.
In: Computational mechanics : proceedings of the Sixth World Congress on Computational Mechanics [WCCM] in conjunction with the Second Asian-Pacific Congress on Computational Mechanics [APCOM] ; September 5 - 10, 2004, Beijing, China / Eds. Z. H. Yao .... - B, Beijing, Tsinghua Univ. Press [u.a.], [Conference or Workshop Item]

Rangelov, T. ; Dineva, P. ; Gross, Dietmar (2003):
Inverse scattering by line cracks in elastic solid.
In: Inverse Problems in Engineering, 11, pp. 141-155. [Article]

Dineva, P. ; Rangelov, T. ; Gross, Dietmar (2002):
Dynamic behavior of a bi-material interface cracked plate.
In: Engineering fracture mechanics, 99, pp. 1193-1218. [Article]

Dineva, P. ; Rangelov, T. ; Gross, Dietmar (2002):
Dynamic behavior of a cracked solder joint.
In: Journal of sound and vibration, 256, pp. 81-102. [Article]

Dineva, P. ; Gross, D. ; Rangelov, T. (1999):
Evaluation of scattered wave and stress concentration field in a damage solder joint.
In: Journal of sound and vibration, 223, pp. 213-230. [Article]

Dineva, P. ; Gross, D. ; Rangelov, T. (1999):
Ultrasonic wave scattering by a line crack in a solder joint.
In: Research in nondestructive evaluation, 11, pp. 117-135. [Article]

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