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Pericet-Camara, R. ; Bonaccurso, E. ; Graf, K. (2008):
Microstructuring of polystyrene surfaces by non-solvent sessile droplets.
In: Chem Phys Chem, 9, pp. 1738-1746. [Article]
Schönfeld, F. ; Graf, K. ; Hardt, Steffen ; Butt, Hans-Jürgen (2008):
Time of evaporation of sessile liquid drops in still air with constant contact radius.
In: Int. J. Heat Mass Transfer, 51, pp. 3696-3699. [Article]
Haschke, T. ; Wiechert, W. ; Graf, K. ; Bonaccurso, E. ; Li, G. ; Suttmeier, F. T. (2007):
Evaporation of Solvent Microdrops on Polymer Substrates: From Well Controlled Experiments To Mathematical Models and Back.
In: Nanoscale and Microscale Thermophysical Engineering, 11 (1-2), p. 31. ISSN 1556-7265,
[Article]
Haschke, T. ; Graf, K. ; Bonaccurso, E. ; Li, G. ; Suttmeier, F. T. ; Wiechert, W.
Gad-el-Hak, M. (ed.) (2006):
Evaporation of Solvent Microdrops on Polymer Substrates: Crater Geometries and Parameter Sensitivity Analysis.
In: Paper No. VIII-5, CD Publication, VIII-5, Second International Conference on Transport Phenomena in Micro and Nanodevices, Brooklyn, New York, [Conference or Workshop Item]
Bonaccurso, E. ; Cappella, B. ; Graf, K. (2006):
Local Mechanical Properties of Plasma Treated Polystyrene Surfaces.
In: The Journal of Physical Chemistry B, 110 (36), p. 17918. ISSN 1520-6106,
[Article]
Bonaccurso, Elmar ; Butt, Hans-Jürgen ; Graf, K. (2004):
Microarrays by structured substrate swelling.
In: European Polymer Journal, 40 (5), p. 975. ISSN 00143057,
[Article]
Bonaccurso, E. ; Butt, Hans-Jürgen ; Franz, V. ; Graf, K. ; Kappl, M. ; Loi, S. ; Niesenhaus, B. ; Chemnitz, S. ; Böhm, M. ; Petrova, B. ; Jonas, U. ; Spiess, H. W. (2002):
Water Induced Dewetting of Ultrathin Polystyrene Films on Hydrophilic Surfaces.
In: Langmuir, 18 (21), p. 8056. ISSN 0743-7463,
[Article]
Adamy, J. ; Graf, K. ; Wurmthaler, Ch. (1995):
Modellierung von Papiermaschinen für Flächengewichts-Querprofilregelungen.
In: at - Automatisierungstechnik, 43 (10), pp. 468-475. Oldenbourg Wissenschaftsverlag GmbH, ISSN 0178-2312,
DOI: 10.1524/auto.1995.43.10.468,
[Article]