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Inside Job: Diagnosing Bluetooth Lower Layers Using Off-the-Shelf Devices

Classen, Jiska ; Hollick, Matthias (2019)
Inside Job: Diagnosing Bluetooth Lower Layers Using Off-the-Shelf Devices.
12th ACM Conference on Security and Privacy in Wireless and Mobile Networks (WiSec'19). Miami, FL, USA (15.05.2019-17.05.2019)
doi: 10.1145/3317549.3319727
Konferenzveröffentlichung, Bibliographie

Kurzbeschreibung (Abstract)

Bluetooth is among the dominant standards for wireless short-range communication with multi-billion Bluetooth devices shipped each year. Basic Bluetooth analysis inside consumer hardware such as smartphones can be accomplished observing the Host Controller Interface (HCI) between the operating system’s driver and the Bluetooth chip. However, the HCI does not provide insights to tasks running inside a Bluetooth chip or Link Layer (LL) packets exchanged over the air. As of today, consumer hardware internal behavior can only be observed with external, and often expensive tools, that need to be present during initial device pairing. In this paper, we leverage standard smartphones for on-device Bluetooth analysis and reverse engineer a diagnostic protocol that resides inside Broadcom chips. Diagnostic features include sniffing lower layers such as LL for Classic Bluetooth and Bluetooth Low Energy (BLE), transmission and reception statistics, test mode, and memory peek and poke.

Typ des Eintrags: Konferenzveröffentlichung
Erschienen: 2019
Autor(en): Classen, Jiska ; Hollick, Matthias
Art des Eintrags: Bibliographie
Titel: Inside Job: Diagnosing Bluetooth Lower Layers Using Off-the-Shelf Devices
Sprache: Englisch
Publikationsjahr: 15 Mai 2019
Veranstaltungstitel: 12th ACM Conference on Security and Privacy in Wireless and Mobile Networks (WiSec'19)
Veranstaltungsort: Miami, FL, USA
Veranstaltungsdatum: 15.05.2019-17.05.2019
DOI: 10.1145/3317549.3319727
Kurzbeschreibung (Abstract):

Bluetooth is among the dominant standards for wireless short-range communication with multi-billion Bluetooth devices shipped each year. Basic Bluetooth analysis inside consumer hardware such as smartphones can be accomplished observing the Host Controller Interface (HCI) between the operating system’s driver and the Bluetooth chip. However, the HCI does not provide insights to tasks running inside a Bluetooth chip or Link Layer (LL) packets exchanged over the air. As of today, consumer hardware internal behavior can only be observed with external, and often expensive tools, that need to be present during initial device pairing. In this paper, we leverage standard smartphones for on-device Bluetooth analysis and reverse engineer a diagnostic protocol that resides inside Broadcom chips. Diagnostic features include sniffing lower layers such as LL for Classic Bluetooth and Bluetooth Low Energy (BLE), transmission and reception statistics, test mode, and memory peek and poke.

Freie Schlagworte: Solutions; S1
Fachbereich(e)/-gebiet(e): 20 Fachbereich Informatik
20 Fachbereich Informatik > Sichere Mobile Netze
DFG-Sonderforschungsbereiche (inkl. Transregio)
DFG-Sonderforschungsbereiche (inkl. Transregio) > Sonderforschungsbereiche
LOEWE
LOEWE > LOEWE-Zentren
LOEWE > LOEWE-Zentren > CRISP - Center for Research in Security and Privacy
DFG-Sonderforschungsbereiche (inkl. Transregio) > Sonderforschungsbereiche > SFB 1053: MAKI – Multi-Mechanismen-Adaption für das künftige Internet
DFG-Sonderforschungsbereiche (inkl. Transregio) > Sonderforschungsbereiche > SFB 1053: MAKI – Multi-Mechanismen-Adaption für das künftige Internet > A: Konstruktionsmethodik
DFG-Sonderforschungsbereiche (inkl. Transregio) > Sonderforschungsbereiche > SFB 1053: MAKI – Multi-Mechanismen-Adaption für das künftige Internet > A: Konstruktionsmethodik > Teilprojekt A3: Migration
DFG-Sonderforschungsbereiche (inkl. Transregio) > Sonderforschungsbereiche > SFB 1119: CROSSING – Kryptographiebasierte Sicherheitslösungen als Grundlage für Vertrauen in heutigen und zukünftigen IT-Systemen
Hinterlegungsdatum: 08 Mai 2019 08:11
Letzte Änderung: 10 Jun 2021 06:11
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