Haag, Sebastian ; Anderl, Reiner (2018)
Digital twin – Proof of concept.
In: Manufacturing Letters, 15
doi: 10.1016/j.mfglet.2018.02.006
Artikel, Bibliographie
Kurzbeschreibung (Abstract)
Miniaturization and price decline enable the integration of information, communication and sensor tech- nologies into virtually any product. Products become able to sense their own state as well as the state of their environment. Paired with the ability to process and communicate this data allows for the creation of digital twins. The digital twin is a comprehensive digital representation of an individual product that will play an integral role in a fully digitalized product life cycle. To prove the digital twin concept a cyber- physical bending beam test bench was developed at DiK research lab.
Typ des Eintrags: | Artikel | ||||
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Erschienen: | 2018 | ||||
Autor(en): | Haag, Sebastian ; Anderl, Reiner | ||||
Art des Eintrags: | Bibliographie | ||||
Titel: | Digital twin – Proof of concept | ||||
Sprache: | Englisch | ||||
Publikationsjahr: | 2018 | ||||
Verlag: | Elsevier | ||||
Titel der Zeitschrift, Zeitung oder Schriftenreihe: | Manufacturing Letters | ||||
Jahrgang/Volume einer Zeitschrift: | 15 | ||||
DOI: | 10.1016/j.mfglet.2018.02.006 | ||||
URL / URN: | https://doi.org/10.1016/j.mfglet.2018.02.006 | ||||
Kurzbeschreibung (Abstract): | Miniaturization and price decline enable the integration of information, communication and sensor tech- nologies into virtually any product. Products become able to sense their own state as well as the state of their environment. Paired with the ability to process and communicate this data allows for the creation of digital twins. The digital twin is a comprehensive digital representation of an individual product that will play an integral role in a fully digitalized product life cycle. To prove the digital twin concept a cyber- physical bending beam test bench was developed at DiK research lab. |
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Alternatives oder übersetztes Abstract: |
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Freie Schlagworte: | Industrie 4.0, Digital twin, Cyber-physical systems, Test bed, Proof of concept | ||||
Fachbereich(e)/-gebiet(e): | 16 Fachbereich Maschinenbau 16 Fachbereich Maschinenbau > Fachgebiet Datenverarbeitung in der Konstruktion (DiK) (ab 01.09.2022 umbenannt in "Product Life Cycle Management") |
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Hinterlegungsdatum: | 26 Apr 2018 11:13 | ||||
Letzte Änderung: | 07 Okt 2020 08:59 | ||||
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